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HYB51 N74ACT 250V5 74LVC 12SH3 732C0520 TDA8563A 9S12X
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  31142 Datasheet PDF File

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    87831-1421 0878311421

Molex Electronics Ltd.
Part No. 87831-1421 0878311421
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Vertical, Through Hole, Shrouded, Lead-free, 14 Circuits, 0.76μm (30μ) Gold (Au) Plating, Center Polarization Slot
2.00mm (.079) Pitch Milli-Grid Header, Vertical, Through Hole, Shrouded, Lead-free, 14 Circuits, 0.76μm (30μ) Gold (Au) Plating, Center Polarization Slot

File Size 218.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-3114-21H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87831-1429 0878311429

Molex Electronics Ltd.
Part No. 87831-1429 0878311429
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Vertical, Through Hole, Shrouded, Lead-free, 14 Circuits, 0.76μm (30μ) Gold (Au) Plating, Center Polarization Slot
2.00mm (.079) Pitch Milli-Grid Header, Vertical, Through Hole, Shrouded, Lead-free, 14 Circuits, 0.76μm (30μ) Gold (Au) Plating, Center Polarization Slot

File Size 189.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 77311-420-12LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    3022-14B AE-3022-14B 0022031142

Molex Electronics Ltd.
Part No. 3022-14B AE-3022-14B 0022031142
Description 2.50mm (.098) Pitch Header, Single Row, 11.10mm (..437) Mating Pin Length, 14 Circuits

File Size 103.82K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-422-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 10 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

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