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Rochester Electronics LLC |
Part No. |
CY7C429-20VC
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Description |
CY7C429 - FIFO, 2KX9, 20ns, Asynchronous, CMOS, PDSO28
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
67292-036LF
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Description |
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 72 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
67292-034
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Description |
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 68 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
67292-009
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Description |
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 18 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
67292-022
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Description |
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 44 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
67292-046LF
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Description |
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 92 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
67292-016LF
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Description |
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
67292-018LF
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Description |
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 36 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
14-44-2920 A-70475-1314
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Description |
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 0.76μm (30μ) Gold (Au), 20 Circuits 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 0.76μm (30μ) Gold (Au), 20 Circuits
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File Size |
141.38K /
2 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
67292-015LF
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Description |
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 30 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
67292-044
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Description |
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 88 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
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Tech specs |
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Official Product Page
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Bom2Buy.com

Price and Availability
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