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  UDS-3611 Datasheet PDF File

For UDS-3611 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    MGFC39V3436 MGFC39V343611

Mitsubishi Electric Semiconductor
Part No. MGFC39V3436 MGFC39V343611
Description C band internally matched power GaAs FET
File Size 86.74K  /  2 Page

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Amphenol Communications Solutions
Part No. 89036-112LF
Description Metral® Board Connectors, Backplane Connectors, 4 Row Signal Receptacle, Right Angle, Solder-to-Board.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





   
Part No. CXK77B3611AGB_5
Description From old datasheet system
File Size 78.05K  /  4 Page

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Amphenol Communications Solutions
Part No. 53611-G40-8LF
Description Quickie Header, Wire to Board Connector, Double Row, 40 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs 　 　

Official Product Page

   
Part No. IBM043611ULAA-6 IBM043611ULAA-5
Description x36 Fast Synchronous SRAM
File Size 910.63K  /  18 Page

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Amphenol Communications Solutions
Part No. 54121-107361150LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    APS3611 APS3611RS26Q1

ANADIGICS, Inc
Part No. APS3611 APS3611RS26Q1
Description 870 GHz Two-way Active Power Splitter Optimized for MOCA-Enabled Subscriber equipment
File Size 317.65K  /  10 Page

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Amphenol Communications Solutions
Part No. 53611-G34-4LF
Description Quickie Header, Wire to Board Connector, Double Row, 34 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs 　 　

Official Product Page

    PUDP-26-S S14B-PUDSS-1 S28B-PUDSS-1 S08B-PUDSS-1 B08B-PUDSS B12B-PUDSS B18B-PUDSS B22B-PUDSS B24B-PUDSS B20B-PUDSS B36B-

JST Mfg. Co., Ltd.
List of Unclassifed Manufacturers
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Part No. PUDP-26-S S14B-PUDSS-1 S28B-PUDSS-1 S08B-PUDSS-1 B08B-PUDSS B12B-PUDSS B18B-PUDSS B22B-PUDSS B24B-PUDSS B20B-PUDSS B36B-PUDSS S26B-PUDSS-1 S20B-PUDSS-1 B28B-PUDSS B30B-PUDSS B38B-PUDSS S10B-PUDSS-1 B32B-PUDSS B40B-PUDSS S12B-PUDSS-1 S18B-PUDSS-1 S24B-PUDSS-1 B26B-PUDSS B34B-PUDSS S16B-PUDSS-1 S22B-PUDSS-1 BM30B-PUDSS-TFC BM20B-PUDSS-TFC BM28B-PUDSS-TFC S38B-PUDSS-1 S36B-PUDSS-1 SPUD-001T-P0.5 S34B-PUDSS-1 B10B-PUDSS-1 B28B-PUDSS-1 B30B-PUDSS-1 B22B-PUDSS-1 PUDP-34V-S PUDP-38V-S
Description 26 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, CRIMP
2.0mm pitch/Disconnectable Crimp style connectors
   2.0mm pitch/Disconnectable Crimp style connectors
File Size 294.39K  /  4 Page

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Amphenol Communications Solutions
Part No. 53611-G10-8LF
Description Quickie Header, Wire to Board Connector, Double Row, 10 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs 　 　

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K7P801811M-H20 K7P801811M-H21 K7P801811M-H25 K7P803611M-H20 K7P803611M-H21 K7P803611M-H25
Description 256Kx36 & 512Kx18 SRAM
256Kx36 & 512Kx18 SRAM
File Size 213.93K  /  13 Page

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Amphenol Communications Solutions
Part No. 53611-G26-6LF
Description Quickie Header, Wire to Board Connector, Double Row, 26 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs 　 　

Official Product Page

    K7P803611M-H21 K7P801811M K7P801811M-H20 K7P801811M-H21 K7P801811M-H25 K7P803611M K7P803611M-H20 K7P803611M-H25

SAMSUNG[Samsung semiconductor]
Part No. K7P803611M-H21 K7P801811M K7P801811M-H20 K7P801811M-H21 K7P801811M-H25 K7P803611M K7P803611M-H20 K7P803611M-H25
Description 256Kx36 & 512Kx18 SRAM
File Size 212.19K  /  13 Page

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Amphenol Communications Solutions
Part No. 91036-110LF
Description Rib-Cage® Board To Board Connector, Surface Mount Vertical Shrouded PCB Header, 20 Positions, Holddown Mounting style.
Tech specs 　 　

Official Product Page

    LTC3411 LTC3404 LTC3405 LTC3407-2 LTC3406B LTC3610 LTC3611 LTC3441

Linear Technology
Part No. LTC3411 LTC3404 LTC3405 LTC3407-2 LTC3406B LTC3610 LTC3611 LTC3441
Description 2.5A, 10V, Monolithic Synchronous Step-Down Regulator
File Size 223.97K  /  20 Page

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Amphenol Communications Solutions
Part No. 89361-114LF
Description Minitek® IDC 2.00mm Pitch, Wire To Board Connector, Receptacle.
Tech specs 　 　

Official Product Page

    Powerex Power Semicondu...
Part No. RD750VA-SIPMUDSP1 RD3KVA-MINIDIP RD3KVA-MINIDIPMUDSP1 RD10KVA-DIPMUDSP1
Description Complete Power Stage
File Size 113.37K  /  1 Page

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Amphenol Communications Solutions
Part No. 89361-120LF
Description Minitek® IDC 2.00mm Pitch, Wire To Board Connector, Receptacle.
Tech specs 　 　

Official Product Page

    K7P803611B K7P803611B-HC33 K7P803611B-HC30 K7P801811B K7P801811B-HC25 K7P801811B-HC27 K7P801811B-HC30 K7P801811B-HC33 K7

SAMSUNG[Samsung semiconductor]
Part No. K7P803611B K7P803611B-HC33 K7P803611B-HC30 K7P801811B K7P801811B-HC25 K7P801811B-HC27 K7P801811B-HC30 K7P801811B-HC33 K7P803611B-HC25 K7P803611B-HC27
Description 256Kx36 & 512Kx18 Synchronous Pipelined SRAM
File Size 247.30K  /  13 Page

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Amphenol Communications Solutions
Part No. 89361-148LF
Description Minitek® IDC 2.00mm Pitch, Wire To Board Connector, Receptacle.
Tech specs 　 　

Official Product Page

For UDS-3611 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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