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perimeter Datasheet PDF File

For perimeter Found Datasheets File :: 879 Search Time::1.594ms
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				Hittite Microwave Corporation
Part No.	HMC566 HMC565
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 29 - 36 GHz GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 6 - 20 GHz
File Size	287.26K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corpo... Hittite Microwave Corporation 美国讯泰微波有限公司上海代表
Part No.	HMC322
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wit...
Description	GaAs MMIC SP8T NON-REFLECTIVE SWITCH, DC - 10.0 GHz GaAs MMIC SP8T NON-REFLECTIVE SWITCH/ DC - 10.0 GHz
File Size	175.07K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC329
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. 5 MIXERS - CHIP 5 - 87 Wire Bonding RF bonds made with 0.003" x 0.0005" ribbon are recommended. Thes...
Description	GaAs MMIC DOUBLE-BALANCED MIXER/ 25 - 40 GHz GaAs MMIC DOUBLE-BALANCED MIXER, 25 - 40 GHz
File Size	163.05K / 6 Page	View it Online	Download Datasheet

				Z-Communications, Inc
Part No.	V600ME02
OCR Text	...IUS OF ALL 14 HALF HOLES AT THE perimeter OF THE BOARD ARE PLATED TO PROVIDE A SURFACE FOR THE ATTACHMENT OF THE VCO TO A PCB IN 11 LOCATIONS, WITH 3 PADS BEING USED FOR ELECTROMECHANICAL INTERFACE. 14 SOLDER LOCATIONS REQUIRED. 2. THE SURF...
Description	VOLTAGE CONTROLLED OSCILLATOR
File Size	43.46K / 2 Page	View it Online	Download Datasheet

				Fujitsu Component Limited. FUJITSU[Fujitsu Media Devices Limited]
Part No.	FTR-P2CP009W1 FTR-P2CP012W1 FTR-P2CP010W1 FTR-P2 FTR-P2CN009W1 FTR-P2CN010W1 FTR-P2CN012W1
OCR Text	...tions. All terminals are on the perimeter. High breaking capability. In addition to the standard gap product (0.3 mm), a higher gap product (0.6 mm), suitable for over voltage breaking can be supplied. Typical applications Power window, Doo...
Description	SILENT TWIN RELAY FOR AUTOMOTIVE APPLICATIONS 1POLE X 2, H-BRIDGE, 25A
File Size	48.94K / 6 Page	View it Online	Download Datasheet

				Sony Corporation
Part No.	ILX551B
OCR Text	...ore than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm Upper ceramic layer 39N 29N 29N 0.9Nm Lower ceramic layer (1) Low-mel...
Description	2048-pixel CCD Linear Sensor (B/W)
File Size	89.18K / 10 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	ILX550K
OCR Text	...ore than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm Cover glass 0.9Nm , , Plastic portion 39N 29N 29N Ceram...
Description	From old datasheet system 10680 pixel X 3 line CCD Linear Sensor (Color)
File Size	148.42K / 11 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC392
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wit...
Description	GaAs MMIC LOW NOISE AMPLIFIER, 3.5 - 7.0 GHz
File Size	225.43K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC395
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wit...
Description	InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 4.0 GHz
File Size	197.46K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC396
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wit...
Description	InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 8.0 GHz
File Size	212.33K / 6 Page	View it Online	Download Datasheet

For perimeter Found Datasheets File :: 879 Search Time::1.594ms
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