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  MW500-1303 Datasheet PDF File

For MW500-1303 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    0522130311

Molex Electronics Ltd.
Part No. 0522130311
Description 2.50mm (.098) Pitch Splash Proof Wire-to-Wire Receptacle Housing, 3 and 4 CircuitVersion, 3 Circuits

File Size 177.98K  /  3 Page

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Coilcraft Inc

Part No. 13031CL
Description Power choke, toroid, RoHS
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0351551303 SD-35155-1303

Molex Electronics Ltd.
Part No. 0351551303 SD-35155-1303
Description 2.50mm (.098) Pitch Wire-to-Board Housing

File Size 104.02K  /  2 Page

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Amphenol Communications Solutions

Part No. 130-3162-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Daughtercard Module, Nickel Sulfamate.
Tech specs    

Official Product Page

    SI1303DL-T1 SI1303DL-T1-E3 SI1303DL08

Vishay Siliconix
Part No. SI1303DL-T1 SI1303DL-T1-E3 SI1303DL08
Description P-Channel 2.5-V (G-S) MOSFET

File Size 96.34K  /  5 Page

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Amphenol Communications Solutions

Part No. 130-3162-15H
Description Paladin Plus 3-Pair, 6 Column, Right Angle Receptacle, Signal Module, APP
Tech specs    

Official Product Page

    0906351303 90635-1303

Molex Electronics Ltd.
Part No. 0906351303 90635-1303
Description 1.27mm (.050") Pitch QF-50, Single Beam, Vertical MIL/DIN Version, 0.38um (15u") Gold (Au), 30 Circuits
1.27mm (.050) Pitch QF-50, Single Beam, Vertical MIL/DIN Version, 0.38um (15u) Gold (Au), 30 Circuits

File Size 219.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 130-3182-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Daughtercard Module, APP.
Tech specs    

Official Product Page

    0850130385 85013-0385

Molex Electronics Ltd.
Part No. 0850130385 85013-0385
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, C-Pin Press-Fit Style R/2 Reverse

File Size 311.07K  /  6 Page

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Amphenol Communications Solutions

Part No. 130-3142-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, APP.
Tech specs    

Official Product Page

    0901303244 90130-3244

Molex Electronics Ltd.
Part No. 0901303244 90130-3244
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 44 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 44 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating

File Size 168.54K  /  4 Page

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Amphenol Communications Solutions

Part No. 130-3182-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Daughtercard Module, Nickel Sulfamate.
Tech specs    

Official Product Page

    0901303240 90130-3240

Molex Electronics Ltd.
Part No. 0901303240 90130-3240
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 40 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 40 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating

File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 130-3142-15D
Description Paladin Plus 3-Pair, 4 Column, Right Angle Receptacle, Signal Module, NiS
Tech specs    

Official Product Page

    0878313035

Molex Electronics Ltd.
Part No. 0878313035
Description 2.00mm (.079) Pitch Milli-Grid Header, Vertical, Through Hole, Shrouded, Lead-free, 30 Circuits, 0.76μm (15μ) Gold (Au) Plating, PCB Locator, Center Polarization Slot

File Size 134.92K  /  3 Page

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Amphenol Communications Solutions

Part No. 130-3182-15H
Description Paladin Plus 3-Pair, 8 Column, Right Angle Receptacle, Signal Module, APP
Tech specs    

Official Product Page

    0901303208 90130-3208

Molex Electronics Ltd.
Part No. 0901303208 90130-3208
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 8 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 8 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating

File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 130-3162-15D
Description Paladin Plus 3-Pair, 6 Column, Right Angle Receptacle, Signal Module, NiS
Tech specs    

Official Product Page

    MGF1303B97 MGF1303B

Mitsubishi Electric Sem...
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. MGF1303B97 MGF1303B
Description LOW NOISE GaAs FET

File Size 324.83K  /  5 Page

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Amphenol Communications Solutions

Part No. 130-3142-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, Nickel Sulfamate.
Tech specs    

Official Product Page

For MW500-1303 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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