|
|
 |
Amphenol Communications Solutions |
Part No. |
63453-316LF
|
Description |
<span style=\\background-color: #FFFF00\\><b>PREFERRED P/N SERIES FOR NEW PROJECT: 10131936</b></span><br><br>Minitek® 2.00mm, Board to Board Connector, Minitek II VCC (HTP), PCB Mounted Receptacle , Vertical , Through Hole, Top Entry, Double row, 16 Positions, 2.00mm (0.079in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
85833-160LF
|
Description |
5 Row Signal Header, Straight, Press-Fit, Wide body, 4 Mod
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
131-3316-21D
|
Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
ICE Components, Inc.
|
Part No. |
LS3316 LS3316-100-RM LS3316-470-RM LS3316-6R8-RM LS3316-3R3-RM LS3316-330-RM LS3316-4R7-RM LS3316-220-RM
|
Description |
10.0mV Dual P-Channel Matched Pair MOSFET Array, Enhancement Mode, 8L PDIP 5.0mV Dual N-Channel EPAD Matched MOSFET Array, Enhancement Mode, 8L PDIP, EPAD Enabled 5.0mV Dual N-Channel EPAD Matched MOSFET Array, Enhancement Mode, 8L SOIC, EPAD Enabled Dual N-Channel EPAD Matched Pair MOSFET Array, Vgs= 3.3 V, Enhancement Mode, 8L SOIC, EPAD Enabled 1 ELEMENT, 3.3 uH, GENERAL PURPOSE INDUCTOR, SMD Surface Mount Power Inductors 1 ELEMENT, 33 uH, GENERAL PURPOSE INDUCTOR, SMD Surface Mount Power Inductors 1 ELEMENT, 4.7 uH, GENERAL PURPOSE INDUCTOR, SMD Surface Mount Power Inductors 1 ELEMENT, 10 uH, GENERAL PURPOSE INDUCTOR, SMD Surface Mount Power Inductors 1 ELEMENT, 22 uH, GENERAL PURPOSE INDUCTOR, SMD
|
File Size |
507.09K /
1 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
101269331604103ALF
|
Description |
HPCE-STRADDLE MOUNT ASSEMBLY 20P10S
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
69133-164HLF
|
Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 64 Positions, 2.54 mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
78233-168HLF
|
Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 68 Positions, 2.54mm (0.100in)Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
131-3316-11H
|
Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, APP.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
69133-168HLF
|
Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 68 Positions, 2.54 mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
91763-316TRLF
|
Description |
Minitek® 2.00mm, Board to Board Connector, PCB Mounted Receptacle , Vertical , Surface Mount, Bottom Entry, Double row, 16 Positions, 2.00mm (0.079in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
101269331604242FLF
|
Description |
HPCE-STRADDLE MOUNT ASSEMBLY 20P24S
|
Tech specs |
|
|
|
Official Product Page
|
|

Bom2Buy.com

Price and Availability
|