FMG-G26S pdf Datasheet P15 Part Num --- IC-ON-LINE


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FMG-G26S Datasheet PDF File

For FMG-G26S Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |

					FAIRCHILD[Fairchild Semiconductor]
Part No.	FMG1G100US60H
Description	IGBT Molding Type Module
File Size	660.15K / 9 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L177HDAG26S
Description	Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Fairchild Semiconductor
Part No.	FMG2G150US60E
Description	Molding Type Module IGBT
File Size	639.90K / 9 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L77HDAG26SOL2RM5C309
Description	Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.76m (30 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
Tech specs				Official Product Page

					Fairchild Semiconductor
Part No.	FMG2G300LS60E
Description	600V, 300A IGBT Module (Molding Type) Molding Type Module
File Size	433.89K / 6 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L177HRAG26S
Description	Dsub, Straight, High Density, Housing only, Crimp & Poke, Bright Tin Shell, 26 Socket, M3 Rear Nut
Tech specs				Official Product Page

					Fairchild Semiconductor
Part No.	FMG2G300US60E
Description	600V, 300A IGBT Module (Molding Type) Molding Type Module
File Size	717.62K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L77HDAG26SOL2C309
Description	Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.76m (30 in) Gold, M3 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
Tech specs				Official Product Page

					Fairchild Semiconductor
Part No.	FMG1G200US60L
Description	600V, 200A IGBT Module (Molding Type)
File Size	548.44K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L177HDAG26SOL2RM5
Description	Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
Tech specs				Official Product Page

					Fairchild Semiconductor
Part No.	FMG1G300US60L
Description	600V, 300A IGBT Module (Molding Type)
File Size	492.02K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L77HDAG26SOL2RM5
Description	Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, Flash Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
Tech specs				Official Product Page

					Fairchild Semiconductor
Part No.	FMG1G150US60L
Description	600V, 150A IGBT Module (Molding Type)
File Size	535.88K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L77HDAG26SOL2
Description	Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, Flash Gold, M3 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
Tech specs				Official Product Page

					Fairchild Semiconductor
Part No.	FMG1G150US60H
Description	600V, 150A IGBT Module (Molding Type)
File Size	535.56K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L77HDAG26SOL2RM8
Description	Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, Flash Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
Tech specs				Official Product Page

					Fairchild Semiconductor
Part No.	FMG1G400US60H
Description	600V, 400A IGBT Module (Molding Type)
File Size	504.21K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L177HDAG26SOL2RM8
Description	Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
Tech specs				Official Product Page

					FAIRCHILD[Fairchild Semiconductor]
Part No.	FMG1G100US60L
Description	IGBT Molding Type Module
File Size	660.41K / 9 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L177HDAG26SOL2
Description	Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38um (15u\\) Gold, M3 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
Tech specs				Official Product Page

For FMG-G26S Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |

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