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480000 LC74723M FR107G SMA6823M TB0467A 2500ET 06N03L 06N03L
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  die-6 Datasheet PDF File

For die-6 Found Datasheets File :: 42407    Search Time::1.344ms    
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    SPANSION LLC
Part No. AM29F400BB-90DPI2
OCR Text die am29f400b known good die cover sheet data sheet (retired product) this product has been retired and is not recommended for des igns. ple...6 7 8 9 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 amd logo location 35 37 38 39 40 41 42 43...
Description 256K X 16 FLASH 5V PROM, 90 ns, UUC43

File Size 220.20K  /  13 Page

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    MAAP-000074-SMB001 MAAP-000074-SMB004 MAAP-000074-PKG001

Tyco Electronics
Part No. MAAP-000074-SMB001 MAAP-000074-SMB004 MAAP-000074-PKG001
OCR Text ...le in: Description Part Number Die MAAPGM0074-DIE Ceramic Pkg Sample Board MAAP-000074-SMB001 Die Sample Board MAAP-000074-SMB004 Electr...6-8 GHz 1 TC = Case Temperature Adjust VGG between -2.6 and -1.2V to achieve specified IDQ. ...
Description Amplifier, Power, 8W 2.0-8.0 GHz

File Size 184.16K  /  5 Page

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    SHT25

List of Unclassifed Manufacturers
Part No. SHT25
OCR Text ...ch), tolerances are 0.1m m. the die pad (center pad) is internally connected to vss . the nc pads must be left floating. vss = gnd, sda = da...6 8 10 0 10 20 30 40 50 60 70 80 90 100 relative humidity (%rh) d dd d rh (%rh) maximaltolerance typ...
Description Humidity and Temperature Sensor

File Size 418.93K  /  12 Page

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    QG80331M500 QG80331M500SL9BE QG80331M800 QG80331M667 NQ80331M500 NQ80331M667

Intel Corporation
Part No. QG80331M500 QG80331M500SL9BE QG80331M800 QG80331M667 NQ80331M500 NQ80331M667
OCR Text ... ?intel ? 80331 i/o processor die details? on page 17 and table 2, ?intel ? 80331 i/o processor device id registers? on page 18 ? stat...6 specification update intel ? 80331 i/o processor revision history january 2005 011 added: ? non-c...
Description Intel 80331 I/O Processor Specification Update

File Size 515.48K  /  67 Page

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    Samsung Electronics
Part No. K4S1G0632D K4S1G0732D
OCR Text die (x4, x8) sdram stacked 1gb d-die sdram specification 54 tsop-ii with pb-free (rohs compliant) information in this docume...6 6.0 pin configuration (top view) ........... .............. .............. .............. .........
Description SDRAM stacked 1Gb D-die

File Size 263.10K  /  14 Page

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    New England Semiconductor
Part No. JAN2N2919 JAN2N2920
OCR Text ...duct assurance are provided for die. 1.2 physical dimensions . see figure 1 (similar to to-78), figur e 2 (surface mount), figure 3 (ja...6 c -65 to +200 (1) for t a > +25 c, derate linearly 1.71 mw/ c, one section; 3.43 ...
Description (JAN2N2919 / JAN2N2920) Transistor

File Size 159.69K  /  18 Page

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    HMC48609

Hittite Microwave Corporation
Hittite Microwave Corpo...
Part No. HMC48609
OCR Text ...om 7 to 9 ghz. this amplifi er die provides 26 db of gain, +34 dbm of saturated power and 24% pae from a +7v supply voltage. output ip3 i...6 db output power for 1 db compression (p1db) 30 33 30.5 33.5 dbm saturated output power (psat) 33....
Description GaAs PHEMT MMIC 2 WATT POWER AMPLIFIER, 7 - 9 GHz

File Size 262.57K  /  8 Page

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    HMC44909

Hittite Microwave Corporation
Part No. HMC44909
OCR Text ...trumentation ? space the hmc449 die is a x2 active broadband frequency multiplier chip utilizing gaas phemt technology. when driven by a 0...6 dbm fo isolation: 34 dbc @ fout= 30 ghz 100 khz ssb phase noise: -132 dbc/hz single supply: 5v @ 5...
Description GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 27 - 33 GHz OUTPUT

File Size 239.51K  /  6 Page

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For die-6 Found Datasheets File :: 42407    Search Time::1.344ms    
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