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STMICROELECTRONICS[STMicroelectronics]
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Part No. |
STE2007DIE2 STE2007
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OCR Text |
...nterface).
Order codes
Type bumped Dice on Waffle Pack Ordering Number STE2007DIE2
November 2005
Rev 1 1/62
www.st.com
62
STE2007
Contents
1 2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .... |
Description |
96 x 68 Single Chip LCD Controller/Driver
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File Size |
638.58K /
62 Page |
View
it Online |
Download Datasheet
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NXP
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Part No. |
TEA5760 TEA5761
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OCR Text |
...ue uses a naked die with solder-bumped contact pads, allowing the die to be soldered directly onto a PCB without under-fill material. The IC is suitable for four-layer PCBs with a 0.5-mm pitch and has an ultra-thin total height of only 600 ... |
Description |
Ultra-small, full-featured FM radio ICs
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File Size |
288.12K /
6 Page |
View
it Online |
Download Datasheet
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Price and Availability
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