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  5.46.167.042-0209 Datasheet PDF File

For 5.46.167.042-0209 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    Vicor, Corp.
VICOR[Vicor Corporation]
Part No. 16765 16765-04
Description OUTLINE DRAWING, HUB1200-S 外形图,HUB1200 -
OUTLINE DRAWING HUB1200-S

File Size 73.77K  /  1 Page

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Rochester Electronics LLC

Part No. MD28F020-90/B
Description 28F020 - 2048K (256K x 8) CMOS Flash Memory
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    VICOR[Vicor Corporation]
Part No. 16767-04 16767
Description OUTLINE DRAWING HUB2200-S
OUTLINE DRAWING, HUB2200-S

File Size 75.28K  /  1 Page

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Rochester Electronics LLC

Part No. MD28F020-90
Description 28F020 - 2048K (256K x 8) CMOS Flash Memory
Tech specs    

Official Product Page

    VICOR[Vicor Corporation]
Part No. 16766 16766-04
Description OUTLINE DRAWING HUB1800-S
OUTLINE DRAWING, HUB1800-S

File Size 74.86K  /  1 Page

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Rochester Electronics LLC

Part No. TN28F020-90
Description 28F020 - 2048K (256K x 8) CMOS Flash Memory
Tech specs    

Official Product Page

    T-10167

Rhombus Industries Inc.
Part No. T-10167
Description T1/CEPT/ISDN PRI INTERFACE TRANSFORMER

File Size 26.46K  /  1 Page

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Rochester Electronics LLC

Part No. MD28F020-90/R
Description 28F020 - 2048K (256K x 8) CMOS Flash Memory
Tech specs    

Official Product Page

   
Part No. 1676-102 1679
Description INTERCONNECTION DEVICE

File Size 139.55K  /  3 Page

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Amphenol Communications Solutions

Part No. 95293-802-09LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Single Row,9 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Electronic Theatre Controls, Inc.
ETC[ETC]
CoEv Inc
Part No. C1676
Description Approved for use with GlobeSpan HDSL2 Chip Set Meets the requirements of IEC60950 for supplementary insulation, 250V working voltage

File Size 40.33K  /  1 Page

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Amphenol Communications Solutions

Part No. 95293-402-09LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Single Row,9 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

   
Part No. BD167
Description ; Repetitive Reverse Voltage Max, Vrrm:6V; Capacitance:100pF; Holding Current:50mA

File Size 158.78K  /  2 Page

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Amphenol Communications Solutions

Part No. 51700-10209602AALF
Description PwrBlade®, Power Connectors, 2P 96S 2P Vertical Header, Solder To Board
Tech specs    

Official Product Page

    American Zettler
Part No. AZ167
Description MINIATURE POWER RELAY

File Size 139.77K  /  3 Page

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Amphenol Communications Solutions

Part No. 95293-102-09LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Single Row,9 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    XC167-16

Infineon Technologies AG
Part No. XC167-16
Description 16-Bit Single-Chip Microcontroller with C166SV2 Core Volume 2 (of 2): Peripheral Units

File Size 3,790.02K  /  442 Page

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Amphenol Communications Solutions

Part No. 95293-502-09LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Single Row,9 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    BOWEI Integrated Circuits C...
Part No. HE167
Description Medium Power Amplifier

File Size 53.49K  /  1 Page

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Amphenol Communications Solutions

Part No. 75160-102-09LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,9 position, 2.54mm pitch
Tech specs    

Official Product Page

For 5.46.167.042-0209 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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