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Molex Electronics Ltd.
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Part No. |
15-80-0121 A-70567-0004 0015800121 705670004
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Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating Molex Electronics Ltd.
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File Size |
1,218.42K /
7 Page |
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Molex Electronics Ltd.
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Part No. |
15-80-0101 70567-0003 A-70567-0003 0015800101
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Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating Molex Electronics Ltd.
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File Size |
1,218.41K /
7 Page |
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it Online |
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Molex Electronics Ltd.
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Part No. |
15-80-0081 A-70567-0002 0015800081 705670002
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Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating Molex Electronics Ltd.
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File Size |
1,218.39K /
7 Page |
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it Online |
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Molex Electronics Ltd.
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Part No. |
15-80-0141 A-70567-0005 0015800141 705670005
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Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating Molex Electronics Ltd.
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File Size |
1,218.38K /
7 Page |
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it Online |
Download Datasheet
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Molex Electronics Ltd.
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Part No. |
0015800281 70567-0012 15-80-0281
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Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating MOLEX Connector
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File Size |
1,218.43K /
7 Page |
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it Online |
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Molex Electronics Ltd.
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Part No. |
87891-0408
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Description |
2.54mm (.100) Pitch KK庐 header, Through Hole, Vertical, 4 Circuit, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch KK? header, Through Hole, Vertical, 4 Circuit, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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File Size |
287.76K /
5 Page |
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it Online |
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Molex Electronics Ltd.
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Part No. |
0447691403 44769-1403
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Description |
3.00mm (.118) Pitch micro-Fit 3.0, BMI?/a> Receptacle header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.8μm (30μ) Gold (Au) Selective, 14 Circuits 3.00mm (.118") Pitch micro-Fit 3.0, BMI垄芒 Receptacle header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.8楼矛m (30楼矛") Gold (Au) Selective, 14 Circuits
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File Size |
141.75K /
3 Page |
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it Online |
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Molex Electronics Ltd.
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Part No. |
0447691402 44769-1402
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Description |
3.00mm (.118) Pitch micro-Fit 3.0, BMI?/a> Receptacle header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.38μm (15μ) Gold (Au) Selective, 14 Circuits 3.00mm (.118") Pitch micro-Fit 3.0, BMI垄芒 Receptacle header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.38楼矛m (15楼矛") Gold (Au) Selective, 14 Circuits
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File Size |
141.75K /
3 Page |
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it Online |
Download Datasheet
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Molex Electronics Ltd.
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Part No. |
53253-1070 0532531070
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Description |
2.00mm (.079) Pitch micro-Latch Wire-to-Board header, Vertical, Square Pin,Three-sided Shroud, Lead-free, 10 Circuits 2.00mm (.079") Pitch micro-Latch垄芒 Wire-to-Board header, Vertical, Square Pin,Three-sided Shroud, Lead-free, 10 Circuits
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File Size |
150.10K /
4 Page |
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it Online |
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Price and Availability
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