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  through-hole micro header Datasheet PDF File

For through-hole micro header Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    15-80-0121 A-70567-0004 0015800121 705670004

Molex Electronics Ltd.
Part No. 15-80-0121 A-70567-0004 0015800121 705670004
Description 2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.42K  /  7 Page

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    15-80-0101 70567-0003 A-70567-0003 0015800101

Molex Electronics Ltd.
Part No. 15-80-0101 70567-0003 A-70567-0003 0015800101
Description 2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.41K  /  7 Page

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    15-80-0081 A-70567-0002 0015800081 705670002

Molex Electronics Ltd.
Part No. 15-80-0081 A-70567-0002 0015800081 705670002
Description 2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.39K  /  7 Page

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    15-80-0141 A-70567-0005 0015800141 705670005

Molex Electronics Ltd.
Part No. 15-80-0141 A-70567-0005 0015800141 705670005
Description 2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.38K  /  7 Page

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    0015800281 70567-0012 15-80-0281

Molex Electronics Ltd.
Part No. 0015800281 70567-0012 15-80-0281
Description 2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
MOLEX Connector

File Size 1,218.43K  /  7 Page

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    87891-0408

Molex Electronics Ltd.
Part No. 87891-0408
Description 2.54mm (.100) Pitch KK庐 header, Through Hole, Vertical, 4 Circuit, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? header, Through Hole, Vertical, 4 Circuit, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 287.76K  /  5 Page

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    0447691403 44769-1403

Molex Electronics Ltd.
Part No. 0447691403 44769-1403
Description 3.00mm (.118) Pitch micro-Fit 3.0, BMI?/a> Receptacle header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.8μm (30μ) Gold (Au) Selective, 14 Circuits
3.00mm (.118") Pitch micro-Fit 3.0, BMI垄芒 Receptacle header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.8楼矛m (30楼矛") Gold (Au) Selective, 14 Circuits

File Size 141.75K  /  3 Page

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    0447691402 44769-1402

Molex Electronics Ltd.
Part No. 0447691402 44769-1402
Description 3.00mm (.118) Pitch micro-Fit 3.0, BMI?/a> Receptacle header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.38μm (15μ) Gold (Au) Selective, 14 Circuits
3.00mm (.118") Pitch micro-Fit 3.0, BMI垄芒 Receptacle header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.38楼矛m (15楼矛") Gold (Au) Selective, 14 Circuits

File Size 141.75K  /  3 Page

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    53253-1070 0532531070

Molex Electronics Ltd.
Part No. 53253-1070 0532531070
Description 2.00mm (.079) Pitch micro-Latch Wire-to-Board header, Vertical, Square Pin,Three-sided Shroud, Lead-free, 10 Circuits
2.00mm (.079") Pitch micro-Latch垄芒 Wire-to-Board header, Vertical, Square Pin,Three-sided Shroud, Lead-free, 10 Circuits

File Size 150.10K  /  4 Page

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    0440672401 SD-44067-001 44067-2401

Molex Electronics Ltd.
Part No. 0440672401 SD-44067-001 44067-2401
Description 3.00mm (.118) Pitch micro-Fit 3.0 Wire-to-Board header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch micro-Fit 3.0 Wire-to-Board header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
MOLEX Connector

File Size 204.11K  /  3 Page

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For through-hole micro header Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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