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perimeter Datasheet PDF File

For perimeter Found Datasheets File :: 893 Search Time::0.875ms
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				Hittite Microwave Corporation
Part No.	HMC527
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic...
Description	GaAs MMIC I/Q MIXER 8.5 - 13.5 GHz
File Size	267.06K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC528
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic...
Description	GaAs MMIC I/Q MIXER 11 - 16 GHz
File Size	267.84K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC553
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic...
Description	GaAs MMIC FUNDAMENTAL MIXER, 7 - 14 GHz
File Size	240.25K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC554
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic...
Description	GaAs MMIC FUNDAMENTAL MIXER, 11 - 20 GHz
File Size	257.00K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC555
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic...
Description	GaAs MMIC I/Q MIXER 31 - 38 GHz
File Size	290.11K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC556
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic...
Description	GaAs MMIC I/Q MIXER 36 - 41 GHz
File Size	281.15K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC560
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding RF bonds made with 0.003" x 0.0005" ribbon are recommended. These bonds should be thermosoni...
Description	GaAs MMIC FUNDAMENTAL MIXER, 24 - 40 GHz
File Size	258.28K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC562
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding RF bonds made with 0.003" x 0.0005" ribbon are recommended. These bonds should be thermosoni...
Description	GaAs PHEMT MMIC WIDEBAND DRIVER AMPLIFIER, 2 - 35 GHz
File Size	331.54K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC564
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 7 - 13.5 GHz
File Size	266.63K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC565
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 6 - 20 GHz
File Size	283.34K / 6 Page	View it Online	Download Datasheet

For perimeter Found Datasheets File :: 893 Search Time::0.875ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |