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  multi-chip package Datasheet PDF File

For multi-chip package Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    NAND01G-N NAND01GR4N5 NAND01GR3N6

STMICROELECTRONICS[STMicroelectronics]
Part No. NAND01G-N NAND01GR4N5 NAND01GR3N6
Description 1 Gbit (x8/x16) 2112 Byte Page NAND Flash Memory and 512 Mbit (x16) LPSDRAM, 1.8V, multi-chip package

File Size 171.67K  /  23 Page

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    IS75V16F128GS32 IS75V16F128GS32-7065BI

ISSI[Integrated Silicon Solution, Inc]
Part No. IS75V16F128GS32 IS75V16F128GS32-7065BI
Description 3.0 Volt multi-chip package (MCP) 128 Mbit Simultaneous Operation Flash Memory and 32 Mbit Pseudo Static RAM

File Size 258.75K  /  52 Page

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    Integrated Silicon Solution, Inc.
Part No. IS75V16F128GS32-7065BI
Description 3.0 Volt multi-chip package (MCP) 128 Mbit Simultaneous Operation Flash Memory and 32 Mbit Pseudo Static RAM

File Size 268.95K  /  52 Page

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    Electronic Theatre Controls, Inc.
Part No. NAND01G-N NAND01GR3N6 NAND01GR4N5
Description 1 Gbit (x8/x16) 2112 Byte Page NAND Flash Memory and 512 Mbit (x16) LPSDRAM, 1.8V, multi-chip package

File Size 176.36K  /  23 Page

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    Integrated Silicon Solution Inc
Part No. IS75V16F128GS32-7065BI
Description 3.0 Volt multi-chip package (MCP) 128 Mbit Simultaneous Operation Flash Memory and 32 Mbit Pseudo Static RAM

File Size 263.13K  /  52 Page

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    Atmel
Part No. PC7410M16 PC7410M16VG400L
Description PC7410 2MByte backside L2-cache multi-chip package
RISC microprocessor. 16 Mbits: 256K x 72 SSRAM. Max internal processor speed 400 MHz. 1.8V -100mV.

File Size 351.43K  /  35 Page

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    Bourns, Inc.
Part No. CS201212-5R6K CS201212-4R7K CS201212-R15K CS201212-3R3K CS201212-R82K CS201212-R68K CS201212-R18K CS201212-68NK CS201212-330K
Description Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 5600000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 4700000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 150000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 3300000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 820000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 680000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 180000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 68000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 33000000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD

File Size 366.70K  /  2 Page

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    AMIC Technology Corporation
Part No. A81L801 A81L801UG-70F A81L801TG-70F
Description Stacked multi-chip package (MCP) 1 M X 8 Bit / 512K X 16 Bit Boot Sector Flash Memory and 128K x 8 Low Voltage CMOS SRAM

File Size 711.51K  /  47 Page

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    K5A3X40YTC K5A3240YBC-T855 K5A3240YTC-T855 K5A3240YT K5A3340YTC-T855 K5A3240YBC-T755 K5A3240YTC-T755 K5A3340YBC-T755 K5A

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K5A3X40YTC K5A3240YBC-T855 K5A3240YTC-T855 K5A3240YT K5A3340YTC-T855 K5A3240YBC-T755 K5A3240YTC-T755 K5A3340YBC-T755 K5A3340YBC-T855 K5A3340YT K5A3340YTC-T755
Description multi-chip package MEMORY 32M Bit (4Mx8/2Mx16) Dual Bank NOR Flash Memory / 4M(512Kx8/256Kx16) Full CMOS SRAM

File Size 863.20K  /  45 Page

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    AMICC[AMIC Technology]
Part No. A81L801UG-70IF A81L801 A81L801TG-70 A81L801TG-70F A81L801TG-70I A81L801TG-70IF A81L801UG-70 A81L801UG-70F A81L801UG-70I
Description Stacked multi-chip package (MCP) 1 M X 8 Bit / 512K X 16 Bit Boot Sector Flash Memory and 128K x 8 Low Voltage CMOS SRAM

File Size 702.29K  /  47 Page

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For multi-chip package Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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