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    MBD54DWT1 ON0402

MOTOROLA[Motorola, Inc]
Part No. MBD54DWT1 ON0402
OCR Text ...dering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will ...
Description From old datasheet system
30 VOLTS DUAL HOT.CARRIER DETECTOR AND SWITCHING DIODES

File Size 83.76K  /  4 Page

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    MBRB1545CT MBRB1545CT_D ON0431 06F9755

Motorola Mobility Holdings, Inc.
ON Semi
MOTOROLA[Motorola, Inc]
Part No. MBRB1545CT MBRB1545CT_D ON0431 06F9755
OCR Text ...g will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and ...
Description CAP SM CER 68PFD 50V 5% NPO 0603 7.5 A, 45 V, SILICON, RECTIFIER DIODE
DIODE SCHOTTKY 2X7.5A
SWITCHMODE Power Rectifier D2PAK Surface Mount Power Package
15 AMPERES 45 VOLTS
From old datasheet system
SWITCHMODE⑩ Power Rectifier D2PAK Surface Mount Power Package

File Size 107.86K  /  6 Page

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    MGSF3442VT1 MGSF3442VT1_D ON1902 ON1901

ON Semi
MOTOROLA[Motorola, Inc]
Part No. MGSF3442VT1 MGSF3442VT1_D ON1902 ON1901
OCR Text ...dering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will ...
Description N-CHANNEL ENHANCEMENT-MODE TMOS MOSFET
From old datasheet system

File Size 138.26K  /  6 Page

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    MGSF3442XT1 MGSF3442XT1_D ON1904 ON1903

ON Semi
MOTOROLA[Motorola, Inc]
Part No. MGSF3442XT1 MGSF3442XT1_D ON1904 ON1903
OCR Text ...dering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will ...
Description N-CHANNEL ENHANCEMENT-MODE TMOS MOSFET
From old datasheet system

File Size 82.92K  /  4 Page

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    MGSF3454VT1 MGSF3454VT1_D ON1906 MGSF3454VT1-D ON1905

ON Semiconductor
MOTOROLA[Motorola, Inc]
MOTOROLA INC
Part No. MGSF3454VT1 MGSF3454VT1_D ON1906 MGSF3454VT1-D ON1905
OCR Text ...dering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will ...
Description Low Rds(on) Small-Signal MOSFETs TMOS Single N-Channel Field Effect Transistors
N-CHANNEL ENHANCEMENT-MODE TMOS MOSFET
From old datasheet system

File Size 121.17K  /  6 Page

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    MGSF3454XT1 MGSF3454XT1_D ON1908 MGSF3454XT1-D ON1907

MOTOROLA[Motorola, Inc]
ON Semiconductor
Part No. MGSF3454XT1 MGSF3454XT1_D ON1908 MGSF3454XT1-D ON1907
OCR Text ...dering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will ...
Description From old datasheet system
N-CHANNEL ENHANCEMENT-MODE TMOS MOSFET
Low Rds(on) Small-Signal MOSFETs TMOS Single N-Channel Field Effect Transistors

File Size 134.23K  /  6 Page

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    MGSF3455VT1 MGSF3455VT1_D ON1910 MGSF3455VT1-D ON1909

MOTOROLA[Motorola, Inc]
ON Semiconductor
Part No. MGSF3455VT1 MGSF3455VT1_D ON1910 MGSF3455VT1-D ON1909
OCR Text ...dering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will ...
Description From old datasheet system
P-CHANNEL ENHANCEMENT?ODE
P-CHANNEL ENHANCEMENT-MODE TMOS MOSFET
Low Rds(on) Small-Signal MOSFETs TMOS Single P-Channel Field Effect Transistors

File Size 122.41K  /  6 Page

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    MGSF3455XT1 MGSF3455XT1_D ON1912 ON1911

ON Semi
MOTOROLA[Motorola Inc]
MOTOROLA[Motorola, Inc]
Part No. MGSF3455XT1 MGSF3455XT1_D ON1912 ON1911
OCR Text ...dering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will ...
Description P-CHANNEL ENHANCEMENT-MODE TMOS MOSFET
P-CHANNEL ENHANCEMENT?ODE
From old datasheet system

File Size 81.59K  /  4 Page

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    MMBT1010LT1 MSD1010T1

Leshan Radio Company, Ltd.
MOTOROLA[Motorola Inc]
MOTOROLA[Motorola, Inc]
Part No. MMBT1010LT1 MSD1010T1
OCR Text ...g will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and ...
Description PNP GENERAL PURPOSE DRIVER TRANSISTORS SURFACE MOUNT 100 mA, 15 V, PNP, Si, SMALL SIGNAL TRANSISTOR

File Size 112.56K  /  4 Page

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    MMBT1010T1 MMBT1010LT1 ON2107

ONSEMI[ON Semiconductor]
Part No. MMBT1010T1 MMBT1010LT1 ON2107
OCR Text ...g will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and ...
Description From old datasheet system
Motorola Preferred Devices
PNP GENERAL PURPOSE DRIVER TRANSISTORS SURFACE MOUNT

File Size 82.10K  /  4 Page

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