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glass ceramic Datasheet PDF File

For glass ceramic Found Datasheets File :: 3351 Search Time::1.094ms
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				MOTOROLA[Motorola, Inc]
Part No.	MMBTA55LT1 MMBTA56LT1
OCR Text	... the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other alternat...ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as T...
Description	Driver Transistors
File Size	77.93K / 4 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	MMBTA56LT1 ON2137
OCR Text	... the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other alternat...ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as T...
Description	Driver Transistors(PNP Silicon) *Motorola Preferred Device From old datasheet system
File Size	56.02K / 4 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. ON Semi MOTOROLA[Motorola, Inc]
Part No.	MMFT2406T1 MMFT2406T MMFT2406T1_D ON2217
OCR Text	...C Sec 1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min...ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as T...
Description	MEDIUM POWER TMOS FET 700 mA 240 VOLTS 0.7 A, 240 V, 6 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-261AA N-hannel Enhancement-ode Logic Level SOT23 From old datasheet system
File Size	87.87K / 6 Page	View it Online	Download Datasheet

				EXAR[Exar Corporation]
Part No.	MP7614 MP7614JN MP7614KD MP7614KN MP7614KS MP7614TD
OCR Text	...or off-center lid, meniscus and glass overrun. 5. The basic lead spacing is 0.100 inch (2.54 mm) between centerlines. 6. Applies to all four corners. 7. This is measured to outside of lead, not center. 0.100 BSC 0.125 0.150 0.015 -- 0.00...
Description	15 V CMOS Multiplying 14-Bit Digital-to-Analog Converter
File Size	90.92K / 8 Page	View it Online	Download Datasheet

				EXAR[Exar Corporation]
Part No.	MP7626 MP7626JD MP7626JN MP7626JP MP7626KD MP7626KN MP7626KP
OCR Text	...or off-center lid, meniscus and glass overrun. 5. The basic lead spacing is 0.100 inch (2.54 mm) between centerlines. 6. Applies to all four...ceramic SIDE-BRAZED DUAL-IN-LINE (600 MIL S/B DIP) C24 S1 24 S 13 1 12 D Base Plane...
Description	Microprocessor Compatible Buffered Multiplying 16-Bit Digital-to-Analog Converter
File Size	117.75K / 12 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc]
Part No.	MSD42WT1 ON2379
OCR Text	... 1. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint. 2. Pulse Test: Pulse Width 300 s...ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as T...
Description	From old datasheet system NPN GENERAL PURPOSE HIGH VOLTAGE TRANSISTORS SURFACE MOUNT
File Size	74.51K / 4 Page	View it Online	Download Datasheet

				TOSHIBA[Toshiba Semiconductor]
Part No.	TA76432F TA76432FC TA76432FR TA76432FT TA76432S
OCR Text	...Unit V mA mA V mA mA Note 1: glass epoxy substrate mounting: 30 mm 30 mm 0.8 mmt (Cu pad area 35 mm ) Note 2: glass epoxy substrate mou...ceramic substate Allowable power dissipation PDmax 120 140 160 0.8 0.8 0.6 0.6 0....
Description	1.26-V Adjustable High-Precision Shunt Regulators
File Size	236.01K / 12 Page	View it Online	Download Datasheet

				ONSEMI[ON Semiconductor]
Part No.	BAS116LT1 ON0112
OCR Text	... the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other alternat...ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as T...
Description	From old datasheet system Switching Diode
File Size	61.54K / 4 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. Motorola Inc MOTOROLA[Motorola, Inc]
Part No.	BAS16LT1 ON0114
OCR Text	... the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other alternat...ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as T...
Description	CASE 31808, STYLE 8 SOT23 (TO236AB) SILICON, SIGNAL DIODE, TO-236AB CASE 31808/ STYLE 8 SOT23 (TO236AB) From old datasheet system
File Size	77.42K / 4 Page	View it Online	Download Datasheet

				ONSEMI[ON Semiconductor]
Part No.	BAS16TT1
OCR Text	...t (1) Device mounted on FR-4 glass epoxy printed circuit board using the minimum recommended footpad. DEVICE MARKING A6 ORDERING...ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as T...
Description	Silicon Switching Diode
File Size	123.64K / 8 Page	View it Online	Download Datasheet

For glass ceramic Found Datasheets File :: 3351 Search Time::1.094ms
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