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SAMSUNG[Samsung semiconductor] Samsung Electronics
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Part No. |
K5D5657DCM-F015 K5D5657DCM-F0CL
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OCR Text |
...-25C ~ 85C * Package : 107-ball FBGA Type - 10.5x13mm, 0.8mm pitch <NAND> * Power Supply Voltage : 2.4~2.9V * Organization - Memory Cell Arr...56 57 D C M - F
Samsung MCP Memory(2chips) Device Type NAND Flash + Mobile SDRAM NAND Flash Density... |
Description |
MCP Specification of 256Mb NAND and 256Mb Mobile SDRAM MCP / 256Mb NAND and 256Mb Mobile SDRAM
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File Size |
1,288.81K /
74 Page |
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it Online |
Download Datasheet
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Price and Availability
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