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  deposition Datasheet PDF File

For deposition Found Datasheets File :: 147    Search Time::2ms    
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    List of Unclassifed Manufac...
Part No. R222508300
OCR Text ... solder procedure 1. deposition of solder paste sn ag4 cu0.5 on mounti ng zone by screen printing application. we recommend a low residue flux. we advise a thickness of 150 m. verify that the ed ges of the zone are clean. 2...
Description MALE STRAIGHT RECEPTACLE FOR PCB SMT TYPE - LIMITED DETENT - REEL 500

File Size 569.74K  /  6 Page

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    MA4M1200 MA4M1300 MA4M3030 MA4M2020 MA4M2300 MA4M1600 MA4M3150 MA4M MA4M1010 MA4M1020 MA4M1030 MA4M1050 MA4M1080 MA4M110

Honeywell International, Inc.
MACOM[Tyco Electronics]
MA-Com
Part No. MA4M1200 MA4M1300 MA4M3030 MA4M2020 MA4M2300 MA4M1600 MA4M3150 MA4M MA4M1010 MA4M1020 MA4M1030 MA4M1050 MA4M1080 MA4M1100 MA4M1250 MA4M2002 MA4M2005 MA4M2100 MA4M3010 MA4M3020 MA4M3050 MA4M3100
OCR Text ...g a low pressure chemical vapor deposition (LPCVD) that results in dense, uniform nitride layers. These capacitors exhibit higher capacitance per unit area (resulting in smaller chip size) than similar MOS, MIS and ceramic capacitors. Evapo...
Description MNS Microwave Chip Capacitors 硫化锰微波贴片电
100 V, MNS microwave chip capacitor
250 V, MNS microwave chip capacitor
200 V, MNS microwave chip capacitor

File Size 40.32K  /  4 Page

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    AN4016

STMicroelectronics
Part No. AN4016
OCR Text ...d: hal lf with tinned chemical deposition. moreover, accurate mounting procedures need to avoid bending/dirt that can compromise the planarity of pcb cards. layout, parts list, and design considerations an4016 8 /17 doc id 022523 rev 1...
Description 2 kW PPA for ISM applications

File Size 969.07K  /  17 Page

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    CREE POWER
Part No. W4NRD0X-0000 W4NRD8C-U000 W4NXD8C-0000 W4NXD8C-L000 W4NXD8D-0000 W4NXD8C-S000 W4NXD8D-S000 W4NXD8G-0000 W6NRE0X-0000 W6NRD0X-0000 W6PXD3O-0000 W6NXD3L-0000 W6NXD0K-0000 W6NXD3K-0000
OCR Text ...ctronic devices ? iii-v nitride deposition physical properties polytype single crystal 4h single crystal 6h crystal structure hexagonal hexagonal bandgap 3.26 ev 3.03 ev thermal conductivity (typical range) 3.0-3.8 w/cm ? k @ 298k (2.3-2.8 ...
Description Diameter: 50.8mm; LCW substrates; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; ultra-low mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; standatd mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; low mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; select mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 76.2mm; LCW type; 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; LCW type; 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; lsemi-insulating (prototype); 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition

File Size 273.34K  /  17 Page

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    C9732DK-11-15

Hamamatsu Corporation
Part No. C9732DK-11-15
OCR Text ...rgout ttl - scintillator direct deposition csi - parameter symbol value unit supply voltage for digital circuitry (+5 v) d.vdd +6.0 v supply v oltage f or analog circuitry (+5 v) a.vdd +6.0 v operating temperature * 1 topr 0 to +40 c storag...
Description For soft X-ray imaging, cassette type with USB 2.0 interface Large photodiode area: 120 x 120 mm

File Size 281.55K  /  9 Page

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    List of Unclassifed Man...
Part No. R210408012
OCR Text ...e in industrial environment 1 ? deposition of solder paste sn ag4 cu0.5 on mounting zone by screen printing application. we recommend a low residue solid flux. we advise a thickness of 200 microns (7.800 microinches). verify that the edges ...
Description STRAIGHT JACK RECEPTACLE FOR PCB SMT TYPE - GOLD 0.2 - REEL OF 100

File Size 396.21K  /  4 Page

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    V600-A44 V600-A45 V600-A81 V600-A86

Omron Electronics LLC
Part No. V600-A44 V600-A45 V600-A81 V600-A86
OCR Text ...e v600-d23p71/d23p72 ultrasonic deposition can be used on the plastic container. attachment v600-a86 for the v600-d23p66n model cable length compatible id controllers xw2z-200s 2 m xw2z-500s 5 m v600-cd1d-v3 v600-cm1d model name compatible ...
Description Non-contact Data Communications System

File Size 3,221.10K  /  34 Page

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For deposition Found Datasheets File :: 147    Search Time::2ms    
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