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  board-to-wire Datasheet PDF File

For board-to-wire Found Datasheets File :: 28285    Search Time::2.547ms    
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    MRF175GU MRF175GV

MOTOROLA[Motorola, Inc]
Part No. MRF175GU MRF175GV
OCR Text ...-- 1.5 - 2.0 H Total Inductance Board material -- .062 fiberglass (G10), Two sided, 1 oz. copper, r 5 R1 -- 100 Ohms, 1/2 W R2 -- 1.0 k O...to increase the common NOTE: mode inductance. For operation below 100 MHz. The NOTE: same is require...
Description N-CHANNEL MOS BROADBAND RF POWER FETs

File Size 183.29K  /  8 Page

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    MRF175GV MRF175GU

MACOM[Tyco Electronics]
Part No. MRF175GV MRF175GU
OCR Text ...2 -- 1.5-2.0 H Total Inductance Board material -- .062 fiberglass (G10), Two sided, 1 oz. copper, r ^ 5 Unless otherwise noted, all chip cap...to increase the common NOTE: mode inductance. For operation below 100 MHz. The NOTE: same is require...
Description From old datasheet system
N-CHANNEL MOS BROADBAND RF POWER FETs

File Size 210.44K  /  11 Page

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    MRF175LU MRF175LV

MOTOROLA[Motorola, Inc]
Part No. MRF175LU MRF175LV
OCR Text ...- Microstrip Line 0.550 x 0.250 Board Material -- 0.062 Teflon -- fiberglass, r = 2.56, 1 oz. copper clad both sides Figure 2. 400 MHz Te...to-drain (Cgd), and gate-to- source (Cgs). The PN junction formed during the fabrication of the FET ...
Description N-CHANNEL BROADBAND RF POWER FETs

File Size 137.22K  /  8 Page

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    MRF175LV MRF175LU

MACOM[Tyco Electronics]
Part No. MRF175LV MRF175LU
OCR Text ...- Microstrip Line 0.550 x 0.250 Board Material -- 0.062 Teflon -- fiberglass, r = 2.56, 1 oz. copper clad both sides L2 -- 12 Turns #18 W...to-drain (Cgd), and gate-to- source (Cgs). The PN junction formed during the fabrication of the FET ...
Description N-CHANNEL BROADBAND RF POWER FETs

File Size 143.35K  /  8 Page

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    MRF176 MRF176GU MRF176GV

MOTOROLA[Motorola, Inc]
Part No. MRF176 MRF176GU MRF176GV
OCR Text ...re, L1 -- Close Wound, 1/4 I.D. Board material -- .062 fiberglass (G10), Two sided, 1 oz. copper, r 5 ^ L2 -- Ferrite Beads of Suitabl...to increase the common NOTE: mode inductance. For operation below 100 MHz. The NOTE: same is require...
Description N-CHANNEL MOS BROADBAND RF POWER FETs

File Size 176.10K  /  10 Page

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    MRF275G MRF275

MOTOROLA[Motorola, Inc]
Part No. MRF275G MRF275
OCR Text ....00 x 0.245, Microstrip Line Board material 0.060 Teflon-fiberglass, r = 2.55, copper clad both sides, 2 oz. copper. Points A are connect...to one half of device, MRF275G 100 Figure 9. Gate-Source Voltage versus Case Temperature I D ...
Description 150 W, 28 V, 500 MHz N.CHANNEL MOS BROADBAND 100 - 500 MHz RF POWER FET

File Size 224.47K  /  12 Page

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    MRF275 MRF275L

MACOM[Tyco Electronics]
Part No. MRF275 MRF275L
OCR Text ... RFC1 RFC2, RFC3 Z1, Z2, Z3 Z4 Board Material 8 Turns AWG #18, 0.25 I.D., Enameled Ferroxcube VK200 19/4B 0.250 x 0.800, Microstrip Line...to Scale) Figure 13. MRF275L Component Location (500 MHz) MRF275L (Scale 1:1) Figure 14....
Description N-CHANNEL BROADBAND RF POWER FET

File Size 265.53K  /  13 Page

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    NX60TA-09SAA3-SP NXT-PA_05 NX-09T-CV NX-09T-F3 NX-09T-F9 NX-09T-KT3 NX-09T-KT9 NX-15T-CV NX-15T-CV1 NX-15T-F3 NX-15T-F9

HIROSE ELECTRIC Co., Ltd.
Hirose Electric USA, INC.
HIROSE[Hirose Electric]
Part No. NX60TA-09SAA3-SP NXT-PA_05 NX-09T-CV NX-09T-F3 NX-09T-F9 NX-09T-KT3 NX-09T-KT9 NX-15T-CV NX-15T-CV1 NX-15T-F3 NX-15T-F9 NX-15T-KT3 NX-15T-KT9 NX-25TA-CV1 NX-25T-BS NX-25T-CV NX-25T-F3 NX-25T-F9 NX-25T-KT3 NX-25T-KT9 NX30H-68P NX30TA-09PAA NX30TA-15PAA NX30TA-25PAA NX30TA-32PAA NX-32TA-CV1 NX-32T-BS NX-32T-F3 NX-32T-F9 NX-32T-KT3 NX-32T-KT9 NX-32T-P NX-32T-P_05 NX-32T-PA NX-32T-PA_05 NX60H-68S9-SP NX60T0-32SAA9-SP NX60TA-09SAA9-SP NX60TA-25SAA3-SP NX60TA-25SAA9-SP NX60TA-32SAA3-SP NX60TB-15SAA3-SP NX60TB-15SAA9-SP NX-68H-CV NX-68H-KT9_05 NX-CSA NX-CSB NXT-P NXT-P_05 NXT-PA NX-32T-P05 NX-32T-PA05 NX-68H-KT905 NXT-P05 NXT-PA05
OCR Text ...file Protorusion above the PCB board is only 2.9mm, and the connectors can be mounted to type I and II I/O cards. Securely attached to the board with optional screws. 8. Card Frame Kits Available as a separate part number. 2. EMI...
Description I/O Card Interface Connectors I / O卡接口连接器
CONNECTOR ACCESSORY
GT 8C 8#16 SKT PLUG
GT 3C 3#12 PIN PLUG
122 x 32 pixel format, LED or EL Backlight available
122 x 32 pixel format, Compact LCD size

File Size 406.08K  /  15 Page

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    PM400DAS060 PM400HSA12 PM800HSA06 PM75RVA060 PM400DVA060 PM100CVA120

MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. PM400DAS060 PM400HSA12 PM800HSA06 PM75RVA060 PM400DVA060 PM100CVA120
OCR Text ... for a separate printed circuit board and ceramic isolation materials. Modules constructed using this technique are easily identified by the...to create a shielded printed circuit directly on the aluminum base plate. Power E2 C2E1 E ...
Description USING INTELLIGENT POWER MODULES
FLAT-BASE TYPE INSULATED PACKAGE

File Size 922.36K  /  31 Page

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    PMB2304 PMB2304R

Infineon Technologies AG
Part No. PMB2304 PMB2304R
OCR Text .... . . . . . . . 4-2 Application Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 Bill of material ....to 127 N counter 3 to 16.383 R counter 3 to 65.535 Serial control (3-wire bus: data, clock, enable) ...
Description PLL-FREQUENCY SYNTHESIZER

File Size 1,333.62K  /  33 Page

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