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INTEGRATED SILICON SOLUTION INC
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| Part No. |
IS42SM16160D-10TL IS42SM32800D-75TL
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| OCR Text |
...s: ? x8 / x16 Ctsop ii (54), bga (54) [x16 only] x32 C tsop ii (86), bga (90) temperature range: ? commercial (0c to +70c) indust...456 bits. internally confgured as a quad-bank dram with a synchronous interface. the 256mb sdram in... |
| Description |
16M X 16 SYNCHRONOUS DRAM, 8 ns, PDSO54
8M X 32 SYNCHRONOUS DRAM, 5.4 ns, PDSO86
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| File Size |
428.14K /
25 Page |
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XILINX INC
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| Part No. |
XC2V3000-6FF1517C
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| OCR Text |
... and wire-bond ball grid array (bga) packages in three standard fine pitches (0.80mm, 1.00mm, and 1.27mm) 100% factory tested 0 virtex-i...456 168 168 3,024 12 1,108 xc2v10000 10m 128 x 120 61,440 1,920 192 192 3,456 12 1,108 table 2: m... |
| Description |
FPGA, 3584 CLBS, 3000000 GATES, PBGA1517
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| File Size |
685.20K /
70 Page |
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it Online |
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HYNIX SEMICONDUCTOR INC
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| Part No. |
HY5DU56422DF-D4
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| OCR Text |
... the balls through the package) bga package ball pattern top view 8.0mm 1.0mm vssq dq14 dq12 dq10 dq8 vref dq15 vddq vssq vddq vssq vss vss dq13 dq11 dq9 udqs udm ck a12, nc a11 a8 a6 a4 ck cke a9 a7 a5 vss we ras ba1 a0 a2 vdd vdd dq2 dq4 ... |
| Description |
64M X 4 DDR DRAM, 0.65 ns, PBGA60
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| File Size |
446.83K /
34 Page |
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it Online |
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HYNIX SEMICONDUCTOR INC
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| Part No. |
HY5DU56422DF-H HY5DU56422DF-K
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| OCR Text |
... the balls through the package) bga package ball pattern top view 8.0mm 1.0mm 1 2 3 7 9 8 a b c d e f g h j k l m (x16) x16 device ball pattern vssq dq14 dq12 dq10 dq8 vref dq15 vddq vssq vddq vssq vss vss dq13 dq11 dq9 udqs udm ck a12 a11 ... |
| Description |
64M X 4 DDR DRAM, 0.75 ns, PBGA60
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| File Size |
268.38K /
31 Page |
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it Online |
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HYNIX SEMICONDUCTOR INC
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| Part No. |
HY5DU56422CLF-J
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| OCR Text |
... the balls through the package) bga package ball pattern top view 8.0mm 1.0mm 1 2 3 7 9 8 a b c d e f g h j k l m (x16) x16 device ball pattern vssq dq14 dq12 dq10 dq8 vref dq15 vddq vssq vddq vssq vss vss dq13 dq11 dq9 udqs udm ck a12 a11 ... |
| Description |
64M X 4 DDR DRAM, 0.7 ns, PBGA60
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| File Size |
298.57K /
31 Page |
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it Online |
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HYNIX SEMICONDUCTOR INC
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| Part No. |
HY5DU56822ELF-J
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| OCR Text |
... the balls through the package) bga package ball pattern top view 8.0mm 1.0mm 1 2 3 7 9 8 a b c d e f g h j k l m (x16) x16 device ball pattern vssq dq14 dq12 dq10 dq8 vref dq15 vddq vssq vddq vssq vss vss dq13 dq11 dq9 udqs udm ck a12 a11 ... |
| Description |
32M X 8 DDR DRAM, 0.7 ns, PBGA60
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| File Size |
246.54K /
29 Page |
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it Online |
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XILINX INC
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| Part No. |
XC2S30-5TQG144Q
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| OCR Text |
...c vqfp plastic pqfp fine pitch bga fine pitch bga plastic tqfp code vq100 pq208 fg256 fg456 tq144 xc2s15 -5 q - - - q xc2s30 -5 - q - - q ...456-ball fine pitch bga xc2s200 pn 011311
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| Description |
FPGA, 216 CLBS, 30000 GATES, PQFP144
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| File Size |
58.50K /
4 Page |
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it Online |
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