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Molex Electronics Ltd.
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| Part No. |
90136-1110 0901361110
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 10 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 10 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.23K /
4 Page |
 View
it Online |
Download Datasheet
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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TLP2309
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| Description |
Photocoupler (photo-IC output), 1 Mbps, 3750 Vrms, 5pin SO6
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90136-1118 0901361118
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 18 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 18 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.24K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
78290-136HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90136-1130 0901361130
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 30 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 30 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.24K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
69190-136HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90136-1132 0901361132
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.24K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68690-136HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
65823-093
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| Description |
Quickie Header, Wire to Board Connector, Double Row, 50 Positions, 2.54 mm (0.1 in.), Right Angle Header 0.76 um (30 u\\.) Gold Mating Plating.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
72309-8023RLF
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| Description |
USB 2.0, Input Output Connector, Double Deck Receptacle, Type A, Through Hole, Right Angle, 8 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
72309-7033RPLF
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| Description |
USB 2.0, Input Output Connector, Double Deck Receptacle, Type A, Through Hole, Right Angle, 8 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68402-309LF
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| Description |
Dubox, Board to board connector, PCB Mounted Receptacle, Surface Mount, Dual Entry, Single Row, 9 Position, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
72309-5044RLF
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| Description |
UNIV SERIAL BUS DOUBLE D
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
72309-7013BLF
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| Description |
USB 2.0, Input Output Connector, Double Deck Receptacle, Type A, Through Hole, Right Angle, 8 Positions
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Official Product Page
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Price and Availability
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