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Amphenol Communications Solutions |
| Part No. |
78290-136HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69190-136HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68690-136HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90136-1110 0901361110
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 10 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 10 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.23K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
U77A11181001
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| Description |
SFP CAGE 1X1 TIN TRAY
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90136-1209 0901361209
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| Description |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 9 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 9 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
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| File Size |
159.24K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
U77C11181011
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| Description |
BRIGHT TIN PLT/R EMI PIN
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90136-1115 0901361115
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 15 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 15 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.33K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68491-118HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-118-09LF
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| Description |
BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded Vertical Header, Through Hole, Single Row, 9 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90136-1125 0901361125
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 25 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 25 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.24K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77311-118-19LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
http://
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| Part No. |
90136-1207 0901361207
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| Description |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 7 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 7 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
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| File Size |
159.24K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77311-118-29LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54111-118021450LF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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