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  71308-5412 Datasheet PDF File

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    KK54123N KK54123S KK54123D

KODENSHI KOREA CORP.
Part No. KK54123N KK54123S KK54123D
Description GROUND FAULT INTERRUPTER EARTH LEAKAGE CURRENT DETECTOR

File Size 319.67K  /  9 Page

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Amphenol Communications Solutions

Part No. 54121-109031550LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0713086430 71308-6430

Molex Electronics Ltd.
Part No. 0713086430 71308-6430
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 30 Circuits, 1.50um (59u) Minimum

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 54121-109081100LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0713086418 71308-6418

Molex Electronics Ltd.
Part No. 0713086418 71308-6418
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 18 Circuits, 1.50μm (59u) Minimum

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 54121-408071800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 7 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0713086440 71308-6440

Molex Electronics Ltd.
Part No. 0713086440 71308-6440
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 40 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 54121-810201950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0713086442 71308-6442

Molex Electronics Ltd.
Part No. 0713086442 71308-6442
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 42 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)

File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions

Part No. 54121-407071500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 7 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0713086426 71308-6426

Molex Electronics Ltd.
Part No. 0713086426 71308-6426
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 26 Circuits

File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions

Part No. 54121-408031600LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0713085462

Molex Electronics Ltd.
Part No. 0713085462
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 62 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 54121-808101500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    78127-1308 0781271308

Molex Electronics Ltd.
Part No. 78127-1308 0781271308
Description 0.50mm (.020) Pitch FFC/FPC Connector, SMT, Non ZIF, Vertical, Reverse, Gold Plating

File Size 580.80K  /  9 Page

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Amphenol Communications Solutions

Part No. 54121-407031500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0713086436

Molex Electronics Ltd.
Part No. 0713086436
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 36 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)

File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions

Part No. 54121-805100900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71308-5446 0713085446

Molex Electronics Ltd.
Part No. 71308-5446 0713085446
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 46 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 54121-108081650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 71308-5412 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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