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  6531-8230 Datasheet PDF File

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    0877823009

Molex Electronics Ltd.
Part No. 0877823009
Description 0.60mm Pitch miniDIMM DDR3 Socket, Vertical, Surface Mount, 0.76m Gold

File Size 24.60K  /  2 Page

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Amphenol Communications Solutions

Part No. 10136653-10LF
Description Minitek® Pwr 3.0, Single Row, Receptacle Housing, 10 Positions, Black Color, Non GW Compatible Nylon66.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0022282304 22-28-2304

Molex Electronics Ltd.
Part No. 0022282304 22-28-2304
Description 2.54mm (.100) Pitch KK庐 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 30 Circuits, Tin (Sn) Plating. with Kinked PC Tails
2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 30 Circuits, Tin (Sn) Plating. with Kinked PC Tails

File Size 221.20K  /  9 Page

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Amphenol Communications Solutions

Part No. 68653-128HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 28 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0022282305 22-28-2305

Molex Electronics Ltd.
Part No. 0022282305 22-28-2305
Description 2.54mm (.100) Pitch KK庐 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 30 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, with Kinked PC Tails
2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Kinked PC Tails

File Size 221.23K  /  9 Page

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Amphenol Communications Solutions

Part No. 68653-130HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TCM8230MD TCM8230MDA

Toshiba Semiconductor
Part No. TCM8230MD TCM8230MDA
Description CMOS Image Sensor
VGA CAMERA MODULE

File Size 947.93K  /  27 Page

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Amphenol Communications Solutions

Part No. 68653-131HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 31 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0022282307 22-28-2307

Molex Electronics Ltd.
Part No. 0022282307 22-28-2307
Description 2.54mm (.100) Pitch KK庐 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 30 Circuits, Tin (Sn) Plating, with Backwalls Removed
2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 30 Circuits, Tin (Sn) Plating, with Backwalls Removed

File Size 221.22K  /  9 Page

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Amphenol Communications Solutions

Part No. 10136653-12LF
Description Minitek® Pwr 3.0, Single Row, Receptacle Housing, 12 Positions, Black Color, Non GW Compatible Nylon66.
Tech specs    

Official Product Page

    0022288230 22-28-8230

Molex Electronics Ltd.
Part No. 0022288230 22-28-8230
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle Surface Mount Compatible, 23 Circuits, Tin (Sn) Plating, Mating Pin Length 6.20mm (.244)
MOLEX Connector

File Size 356.52K  /  20 Page

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Amphenol Communications Solutions

Part No. 68653-112HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87982-3030 0879823030

Molex Electronics Ltd.
Part No. 87982-3030 0879823030
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, Shrouded, Lead-free, 30 Circuits, 0.38μm (15μ) Gold (Au) Plating, Center Polarization Slot, without Cap
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Through Hole, Vertical, Shrouded, Lead-free, 30 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Plating, Center Polarization Slot, w

File Size 118.40K  /  3 Page

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Amphenol Communications Solutions

Part No. 68653-119HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 19 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71M6532D-IGT_F 71M6532F-IGT_F 71M6532F-IGTR_F 71M6531D-IM_F 71M6531F-IM_F 71M6532D-IGTR_F

Teridian Semiconductor Corporation
Part No. 71M6532D-IGT_F 71M6532F-IGT_F 71M6532F-IGTR_F 71M6531D-IM_F 71M6531F-IM_F 71M6532D-IGTR_F
Description Energy Meter IC

File Size 1,866.32K  /  115 Page

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Amphenol Communications Solutions

Part No. 68653-133HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 33 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Analog Devices Inc
AD[Analog Devices]
Part No. AD8230 AD8230YRZ-REEL AD8230YRZ-REEL7 AD8230-EVAL AD8230YRZ
Description 16V Zero-Drift Auto-Zero Instrumentation Amplifier
Amplifier, Other - Datasheet Reference
16 V Rail-to-Rail, Zero-Drift, Precision Instrumentation Amplifier

File Size 269.00K  /  16 Page

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Amphenol Communications Solutions

Part No. 68653-109HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 9 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71M6531D-IMR_F 71M6531F-IMR_F 71M6532D-IGT/F 71M6532F-IGT/F 71M6531D-IM/F 71M6531F-IM/F 71M6531F-IMR/F 71M6532D-IGTR/F 7

Teridian Semiconductor Corporation
Part No. 71M6531D-IMR_F 71M6531F-IMR_F 71M6532D-IGT/F 71M6532F-IGT/F 71M6531D-IM/F 71M6531F-IM/F 71M6531F-IMR/F 71M6532D-IGTR/F 71M6532F-IGTR/F 71M6531D-IMR/F
Description Energy Meter IC

File Size 1,861.82K  /  115 Page

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Amphenol Communications Solutions

Part No. 68653-117HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 17 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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