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ISL88013 HER207 DZ11B Q2008RH4 HCS139D 4221F 6200A 4HCT1
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  1811 Datasheet PDF File

For 1811 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    AUIRS21811S AUIRS21811STR AUIRS21811S-15

International Rectifier
Part No. AUIRS21811S AUIRS21811STR AUIRS21811S-15
Description HIGH AND LOW SIDE DRIVER

File Size 534.30K  /  20 Page

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Amphenol Communications Solutions

Part No. 131-8118-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





   
Part No. K7P403611A-H30 K7P401811A-H30
Description 128K X 36 STANDARD SRAM, 1.8 ns, PBGA119 14 X 22 MM, BGA-119

File Size 296.05K  /  13 Page

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Amphenol Communications Solutions

Part No. 131-8118-11H
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K7P801811M-H20 K7P801811M-H21 K7P801811M-H25 K7P803611M-H20 K7P803611M-H21 K7P803611M-H25
Description 256Kx36 & 512Kx18 SRAM
256Kx36 & 512Kx18 SRAM

File Size 213.93K  /  13 Page

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Amphenol Communications Solutions

Part No. 10131318-18111G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 18 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    K7P803611M-H21 K7P801811M K7P801811M-H20 K7P801811M-H21 K7P801811M-H25 K7P803611M K7P803611M-H20 K7P803611M-H25

SAMSUNG[Samsung semiconductor]
Part No. K7P803611M-H21 K7P801811M K7P801811M-H20 K7P801811M-H21 K7P801811M-H25 K7P803611M K7P803611M-H20 K7P803611M-H25
Description 256Kx36 & 512Kx18 SRAM

File Size 212.19K  /  13 Page

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Amphenol Communications Solutions

Part No. 68418-112HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail
Tech specs    

Official Product Page

    MICRF218 MICRF218AYQS MICRF21811

Micrel Semiconductor
Part No. MICRF218 MICRF218AYQS MICRF21811
Description 3.3V, 315/433MHz Wide-IF Bandwidth ASK Receiver

File Size 834.54K  /  23 Page

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Amphenol Communications Solutions

Part No. 77315-118-11LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    PD412411 PD4111 PD412211 PD411811 PD412011

POWEREX[Powerex Power Semiconductors]
Part No. PD412411 PD4111 PD412211 PD411811 PD412011
Description POW-R-BLOK Dual Diode Isolated Module (1100 Amperes / Up to 2400 Volts)

File Size 87.53K  /  5 Page

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Amphenol Communications Solutions

Part No. 77315-418-11LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    IMP1810 IMP1811 IMP1812 IMP1815 IMP1816 IMP1817 IMP1232LPS-2

A1 PROs co., Ltd.
Part No. IMP1810 IMP1811 IMP1812 IMP1815 IMP1816 IMP1817 IMP1232LPS-2
Description Low Power,, 5V - Ressett- Acttiive LOW,, Open--Draiin Outtputt
5V 楼矛P Power Supplly Moniittor and Ressett Ciircuiitt

File Size 1,779.71K  /  36 Page

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Amphenol Communications Solutions

Part No. 131-4218-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    iMP
Part No. IMP1815 IMP1817 IMP1816 IMP1812 IMP1811 IMP1810 IMP1233M IMP1233D IMP18XX
Description Low Poower, 5V µP Reset, Power Management
Low Poower, 3.3V µP Reset, Power Management
Lo Low P w Po ow wer er, 5V , 5V µ µP P Reset
From old datasheet system

File Size 1,285.76K  /  36 Page

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Amphenol Communications Solutions

Part No. 131-5618-11D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    IMP1233D IMP1810 IMP1811 IMP1812 IMP1815 IMP1816 IMP1817 IMP1233M IMP1233DZ-10_T IMP1233DZ-15_T IMP1233DZ-5_T IMP1233DZ-

IMP INC.
IMP Inc
IMP[IMP, Inc]
IMP[IMP Inc]
Part No. IMP1233D IMP1810 IMP1811 IMP1812 IMP1815 IMP1816 IMP1817 IMP1233M IMP1233DZ-10_T IMP1233DZ-15_T IMP1233DZ-5_T IMP1233DZ-5/T IMP1233DZ-15/T IMP1233DZ-10/T IMP1233DZ-10T IMP1233DZ-15T
Description 4.125V power reset
RELAY 024VDC 01A DPDT-XX FORM:2C UC
Bi-Lobe Standard Metal Shell Nano Offset Connector
Low Power 5V/3.0V P Reset
Low Power/ 5V/ P Reset
Low Power, 5V, 楼矛P Reset
Low Power 5V P Reset
Low Power, 5V, P Reset
Low Power, 5V, μP Reset
4.375V power reset

File Size 116.91K  /  6 Page

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Amphenol Communications Solutions

Part No. 131-7418-11D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    K7P803611B K7P803611B-HC33 K7P803611B-HC30 K7P801811B K7P801811B-HC25 K7P801811B-HC27 K7P801811B-HC30 K7P801811B-HC33 K7

SAMSUNG[Samsung semiconductor]
Part No. K7P803611B K7P803611B-HC33 K7P803611B-HC30 K7P801811B K7P801811B-HC25 K7P801811B-HC27 K7P801811B-HC30 K7P801811B-HC33 K7P803611B-HC25 K7P803611B-HC27
Description 256Kx36 & 512Kx18 Synchronous Pipelined SRAM

File Size 247.30K  /  13 Page

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Amphenol Communications Solutions

Part No. 131-3218-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

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