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SIRENZA[SIRENZA MICRODEVICES]
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Part No. |
SUF-1000
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OCR Text |
...s. 3. Die Thickness is 0.004 (0.100). 4. Typical bond pad is 0.004 (0.100) square. 5. Backside metalization: Gold. 6. Backside is Ground. 7. Bond pad metalization: Gold.
Device Assembly
35 Interconnect Wire or Ribbon Bypass Cap(s)
Ch... |
Description |
DC-20 GHz, Cascadable pHEMT MMIC Amplifier
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File Size |
124.94K /
4 Page |
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it Online |
Download Datasheet |
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Astrodyne, Inc.
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Part No. |
PSP-1000 PSP-1000-15
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OCR Text |
...(v)?60hz 90 115 135 180 230 264 100 90 80 70 60 50 40 load(%) adj led air?flow direction 7 10 3 2 1 control 4-m4 52 200 278 31.75 63.5 o/p 25.75 63.5 127 47.5 39 12 9 6-m3 32 240 185 127 4-m4 52 200 31.75 63.5 i/p 4-m6 2 1 6 2 5 1 8 7 4 3 8... |
Description |
BAT,4-PK,D,NICAD,5000MAH,4.8V, RECHRG,6" LEADS,FIG 16 BAT,2-PK,D,NICAD,5000MAH,2.4V, RECHRG,6" LEADS,FIG 1
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File Size |
411.23K /
2 Page |
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it Online |
Download Datasheet |
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Price and Availability
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