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  TIM-5510 Datasheet PDF File

For TIM-5510 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

   
Part No. TIM1112-15L
Description MICROWAVE POWER GaAs FET 微波功率GaAs场效应管

File Size 457.98K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1109LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 9 Positions, 2.54 mm Pitch, Right Angle
Tech specs    

Official Product Page

HUA FENG CIRCUIT





   
Part No. WT5510 WT5511
Description TRANSISTOR | BJT | NPN | 150A I(C) | STR-3/4
TRANSISTOR | BJT | NPN | 450V V(BR)CEO | 100A I(C) | STX-8

File Size 189.00K  /  2 Page

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Part No. 55102-G1110LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 20 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

   
Part No. TIM5964-16L-151
Description C BAND, Si, N-CHANNEL, RF POWER, JFET

File Size 50.47K  /  2 Page

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Amphenol Communications Solutions

Part No. 55101-T1108LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 8 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM3742-8SL-341

Toshiba Semiconductor
Part No. TIM3742-8SL-341
Description IM3=-45 dBc at Pout= 28.5dBm Single Carrier Level

File Size 242.20K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-S3620LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 20 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    Toshiba
Part No. TIM1414-4LA-371
Description Microwave Power GaAs FET

File Size 339.34K  /  2 Page

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Amphenol Communications Solutions

Part No. 55101-G17-04
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM1414-18L-252

Toshiba Semiconductor
Part No. TIM1414-18L-252
Description MICROWAVE POWER GaAs FET

File Size 39.47K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1104LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM3742-4SL-341

Toshiba Semiconductor
Part No. TIM3742-4SL-341
Description MICROWAVE POWER GaAs FET

File Size 131.97K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1113LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch, Right Angle
Tech specs    

Official Product Page

    TIM5964-8SL-422

Toshiba Semiconductor
Part No. TIM5964-8SL-422
Description MICROWAVE POWER GaAs FET

File Size 86.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 55102-G1703LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    LTC5510

Linear Technology
Part No. LTC5510
Description 1MHz to 6GHz Wideband High Linearity Active Mixer

File Size 626.82K  /  28 Page

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Amphenol Communications Solutions

Part No. 55101-S1120LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    1551095

PHOENIX CONTACT
Part No. 1551095
Description SACB- 8/3-10,0PUR-M8

File Size 86.26K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1102LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 2 Positions, 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

For TIM-5510 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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