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perimeter Datasheet PDF File

For perimeter Found Datasheets File :: 991 Search Time::1.781ms
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				Hittite Microwave Corporation
Part No.	HMC517
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding RF bonds made with 0.003" x 0.0005" ribbon are recommended. These bonds should be thermosoni...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 17 - 26 GHz
File Size	286.67K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC518
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding RF bonds made with 0.003" x 0.0005" ribbon are recommended. These bonds should be thermosoni...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 20 - 32 GHz
File Size	291.06K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC519
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding RF bonds made with 0.003" x 0.0005" ribbon are recommended. These bonds should be thermosoni...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 18 - 32 GHz
File Size	306.71K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC520
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic...
Description	GaAs MMIC I/Q MIXER 6 - 10 GHz
File Size	282.91K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC521
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic...
Description	GaAs MMIC I/Q MIXER 8.5 - 13.5 GHz
File Size	280.40K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC522
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic...
Description	GaAs MMIC I/Q MIXER 11 - 16 GHz
File Size	277.61K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC523
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic...
Description	GaAs MMIC I/Q MIXER 15 - 23.6 GHz
File Size	299.96K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC524
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic...
Description	GaAs MMIC I/Q MIXER 22 - 32 GHz
File Size	275.56K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC525
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic...
Description	GaAs MMIC I/Q MIXER 4.0 - 8.5 GHz
File Size	285.04K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC526
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic...
Description	GaAs MMIC I/Q MIXER 6 - 10 GHz
File Size	272.71K / 6 Page	View it Online	Download Datasheet

For perimeter Found Datasheets File :: 991 Search Time::1.781ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |