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Littelfuse, Inc.
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Part No. |
1210L050 1210L005
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OCR Text |
... refow methods: ir, vapor phase oven, hot air oven, n 2 environment for lead-free ? devices are not designed to be wave soldered to the bottom side of the board. ? recommended maximum paste thickness is 0.25mm (0.010 inch) ? device... |
Description |
POLYFUSEResettable PTCs POLYFUSE㈢复式胆道镜
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File Size |
310.24K /
4 Page |
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it Online |
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HITTITE[Hittite Microwave Corporation]
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Part No. |
HMC265LM3
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OCR Text |
...sually accomplished in a reflow oven but may also use a vapor phase process. A solder reflow profile is suggested above. Prior to reflowing product, temperature profiles should be measured using the same mass as the actual assemblies. The t... |
Description |
GaAs MMIC SUB-HARMONIC SMT MIXER, 20 - 31 GHz GaAs MMIC SUB-HARMONIC SMT MIXER 20 - 31 GHz
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File Size |
292.86K /
8 Page |
View
it Online |
Download Datasheet
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Price and Availability
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