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  device non-isolated Datasheet PDF File

For device non-isolated Found Datasheets File :: 5590    Search Time::1.375ms    
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    K4S643232C-TL55 K4S643232C-TL70 K4S643232C-TC70 V62C5181024LL-70P K4S643232C K4S643232C-TC10 K4S643232C-TC55 K4S643232C-

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4S643232C-TL55 K4S643232C-TL70 K4S643232C-TC70 V62C5181024LL-70P K4S643232C K4S643232C-TC10 K4S643232C-TC55 K4S643232C-TC60 K4S643232C-TC80 K4S643232C-TL10 K4S643232C-TL60 K4S643232C-TL80 K4S643232C-TC_L10 K4S643232C-TC_L55 K4S643232C-TC_L60 K4S643232C-TC_L70 K4S643232C-TC_L80 K4S643232C-TC/L10 K4S643232C-TC/L55 K4S643232C-TC/L60 K4S643232C-TC/L70 K4S643232C-TC/L80
OCR Text ...mmable latencies allow the same device to be useful for a variety of high bandwidth, high performance memory system applications. * * * *...non power-down mode ICC2NS Active standby current in power-down mode Active standby current in non p...
Description 2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL

File Size 1,151.85K  /  43 Page

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    K4S643232E-TL45 K4S643232E-TL55 K4S643232E-TL70 K4S643232E-TC70 K4S643232E K4S643232E-TC45 K4S643232E-TC50 K4S643232E-TC

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S643232E-TL45 K4S643232E-TL55 K4S643232E-TL70 K4S643232E-TC70 K4S643232E K4S643232E-TC45 K4S643232E-TC50 K4S643232E-TC55 K4S643232E-TC60 K4S643232E-TL50 K4S643232E-TL60 K4S643232E-TC/L/E/N/I/P
OCR Text ...mmable latencies allow the same device to be useful for a variety of high bandwidth, high performance memory system applications. * * * *...non power-down mode ICC2NS Active Standby Current in power-down mode ICC3P ICC3PS ICC3N Active St...
Description 2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL 200万32内存512k × 32 × 4银行同步DRAM LVTTL
2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL 200万32内存12k × 32 × 4银行同步DRAM LVTTL
512K x 32Bit x 4 Banks Synchronous DRAM Data Sheet

File Size 100.95K  /  12 Page

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    K4S643232E-TN70 K4S643232E-TE50 K4S643232E- K4S643232E-TE60 K4S643232E-TE70 K4S643232E-TN50 K4S643232E-TN60 K4S643232E

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S643232E-TN70 K4S643232E-TE50 K4S643232E- K4S643232E-TE60 K4S643232E-TE70 K4S643232E-TN50 K4S643232E-TN60 K4S643232E
OCR Text ...mmable latencies allow the same device to be useful for a variety of high bandwidth, high performance memory system applications. * * * *...non power-down mode ICC2NS Active Standby Current in power-down mode ICC3P ICC3PS ICC3N mA 10 7 m...
Description LED ORANGE DIFFUSED 2X5 RECT 200万32内存12k × 32 × 4银行同步DRAM LVTTL.3
2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL(3.3V) 200万32内存12k × 32 × 4银行同步DRAM LVTTL.3
2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL(3.3V) 200万32内存12k × 32 × 4银行同步DRAM LVTTL3.3
LED ORANGE DIFFUSED 2X5 RECT
CONNECTOR ACCESSORY
LED ORG/RED DIFFUSED 2X5MM RECT
-2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL(3.3V)

File Size 99.80K  /  12 Page

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    K4S643232E-TP60 K4S643232E-TP70 K4S643232E-TI K4S643232E-TI60 K4S643232E-TI70

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S643232E-TP60 K4S643232E-TP70 K4S643232E-TI K4S643232E-TI60 K4S643232E-TI70
OCR Text ...mmable latencies allow the same device to be useful for a variety of high bandwidth, high performance memory system applications. * * * *...non power-down mode ICC2NS Active Standby Current in power-down mode ICC3P ICC3PS ICC3N Active St...
Description 2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL 200万32内存12k × 32 × 4银行同步DRAM LVTTL
CONNECTOR ACCESSORY
IR LED 880NM 40 DEG SIDE VIEW

File Size 98.65K  /  12 Page

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    K4S643232F-TL45 K4S643232F-TL55 K4S643232F-TL70 K4S643232F-TC70 K4S643232F-TC60 K4S643232F K4S643232F-TC45 K4S643232F-TC

Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4S643232F-TL45 K4S643232F-TL55 K4S643232F-TL70 K4S643232F-TC70 K4S643232F-TC60 K4S643232F K4S643232F-TC45 K4S643232F-TC50 K4S643232F-TC55 K4S643232F-TL50 K4S643232F-TL60
OCR Text ...mmable latencies allow the same device to be useful for a variety of high bandwidth, high performance memory system applications. * * * *...non power-down mode ICC2NS Active Standby Current in power-down mode ICC3P ICC3PS ICC3N Active St...
Description IR LED 950NM 18 DEG DOUBLE END
2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL 200万32内存12k × 32 × 4银行同步DRAM LVTTL

File Size 100.27K  /  12 Page

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    K4S643232F-TP60 K4S643232F-TP70 K4S643232F- K4S643232F-TI60 K4S643232F-TI70

Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4S643232F-TP60 K4S643232F-TP70 K4S643232F- K4S643232F-TI60 K4S643232F-TI70
OCR Text ...mmable latencies allow the same device to be useful for a variety of high bandwidth, high performance memory system applications. * * * *...non power-down mode ICC2NS Active Standby Current in power-down mode ICC3P ICC3PS ICC3N mA 7 4...
Description    2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL3.3V
-2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL3.3V
CONNECTOR ACCESSORY
2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL3.3V 200万32内存12k × 32 × 4银行同步DRAM LVTTL3.3V

File Size 98.11K  /  12 Page

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    MP02TT800 MP02TT800-13 MP02TT800-14 MP02TT800-15 MP02TT800-16 MP02TT800-12

DYNEX[Dynex Semiconductor]
Dynex Semiconductor Ltd.
Part No. MP02TT800 MP02TT800-13 MP02TT800-14 MP02TT800-15 MP02TT800-16 MP02TT800-12
OCR Text ... FEATURES s s s s s s Dual device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint Alumina (Non Toxic) Isolation Medium Integral Water Cooled Heatsink KEY PARAMETERS 1600V VDRM 510A...
Description 1200V dual thyristor water cooled welding module
Dual Thyristor Water Cooled Welding Module Preliminary Information

File Size 120.52K  /  8 Page

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    MP04TT1400 MP04TT1400-25-W2 MP04TT1400-25-W3 MP04TT1400-25-W3A MP04TT1400-26-W2 MP04TT1400-26-W3 MP04TT1400-26-W3A MP04T

Dynex Semiconductor, Ltd.
Dynex Semiconductor Ltd.
DYNEX[Dynex Semiconductor]
Part No. MP04TT1400 MP04TT1400-25-W2 MP04TT1400-25-W3 MP04TT1400-25-W3A MP04TT1400-26-W2 MP04TT1400-26-W3 MP04TT1400-26-W3A MP04TT1400-27-W2 MP04TT1400-27-W3 MP04TT1400-27-W3A MP04TT1400-28-W2 MP04TT1400-28-W3 MP04TT1400-28-W3A
OCR Text ... FEATURES s s s s s s Dual device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint Alumina (Non Toxic) Isolation Medium Integral Water Cooled Heatsink KEY PARAMETERS VDRM ILINE(cont...
Description Dual Thyristor Water Cooled Welding Module Preliminary Information 1185 A, 2500 V, SCR
Dual Thyristor Water Cooled Welding Module Preliminary Information 1185 A, 2600 V, SCR
Dual Thyristor Water Cooled Welding Module Preliminary Information 1185 A, 2700 V, SCR

File Size 188.34K  /  10 Page

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    MP04TT1550 MP04TT1550-15-W2 MP04TT1550-15-W3 MP04TT1550-15-W3A MP04TT1550-16-W2 MP04TT1550-16-W3 MP04TT1550-16-W3A MP04T

http://
DYNEX[Dynex Semiconductor]
Dynex Semiconductor Ltd.
Dynex Semiconductor, Ltd.
Part No. MP04TT1550 MP04TT1550-15-W2 MP04TT1550-15-W3 MP04TT1550-15-W3A MP04TT1550-16-W2 MP04TT1550-16-W3 MP04TT1550-16-W3A MP04TT1550-17-W2 MP04TT1550-17-W3 MP04TT1550-17-W3A MP04TT1550-18-W2 MP04TT1550-18-W3 MP04TT1550-18-W3A
OCR Text ... FEATURES s s s s s s Dual device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint Alumina (Non Toxic) Isolation Medium Integral Water Cooled Heatsink KEY PARAMETERS VDRM ILINE(cont...
Description Dual Thyristor Water Cooled Welding Module Preliminary Information 1438 A, 1800 V, SCR
Dual Thyristor Water Cooled Welding Module Preliminary Information 1438 A, 1500 V, SCR
Dual Thyristor Water Cooled Welding Module Preliminary Information 1438 A, 1700 V, SCR
Dual Thyristor Water Cooled Welding Module Preliminary Information 1438 A, 1600 V, SCR

File Size 185.61K  /  10 Page

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    MP04TT500 MP04TT500-25-W2 MP04TT500-25-W3 MP04TT500-25-W3A MP04TT500-26-W2 MP04TT500-26-W3 MP04TT500-26-W3A MP04TT500-27

Dynex Semiconductor, Ltd.
Dynex Semiconductor Ltd.
DYNEX[Dynex Semiconductor]
Part No. MP04TT500 MP04TT500-25-W2 MP04TT500-25-W3 MP04TT500-25-W3A MP04TT500-26-W2 MP04TT500-26-W3 MP04TT500-26-W3A MP04TT500-27-W2 MP04TT500-27-W3 MP04TT500-27-W3A MP04TT500-28-W2 MP04TT500-28-W3 MP04TT500-28-W3A
OCR Text ... FEATURES s s s s s s Dual device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint Alumina (Non Toxic) Isolation Medium Integral Water Cooled Heatsink KEY PARAMETERS VDRM IT(AV)(per...
Description Dual Thyristor Water Cooled Module Advance Information 845 A, 2600 V, SCR
Dual Thyristor Water Cooled Module Advance Information 845 A, 2800 V, SCR
Dual Thyristor Water Cooled Module Advance Information 845 A, 2500 V, SCR
Dual Thyristor Water Cooled Module Advance Information 845 A, 2700 V, SCR

File Size 256.96K  /  10 Page

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For device non-isolated Found Datasheets File :: 5590    Search Time::1.375ms    
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