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Duracell TT electronics Semelab, Ltd. NXP Semiconductors N.V.
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| Part No. |
AM29841A/BKA AM29841A/B3A AM29843PC AM29843ALC AM29841ASC AM29843APC AM29843ADE AM29843A/B3A AM29841A/BLA AM29843A/BKA AM29841LM AM29841ALMB AM29841APCB AM29843ADMB
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| Description |
600V Low-Vceon Copack IGBT in a TO-220 FullPak package; Similar to IRGIB7B60KD with Lead Free Packaging 600V UltraFast 10-30 kHz Copack IGBT in a D2-Pak package; A IRGS10B60KD with Standard Packaging 600V UltraFast 10-30 kHz Copack IGBT in a TO-262 package; Similar to IRG4BC15UD-L with Lead Free Packaging 600V UltraFast 10-30 kHz Copack IGBT in a TO-262 package; A IRGSL6B60KD with Standard Packaging 600V UltraFast 10-30 kHz Copack IGBT in a TO-262 package; Similar to IRGSL15B60KD with Lead Free Packaging 1200V UltraFast 4-20 kHz CoPack IGBT in a TO-274AA package; Similar to IRG4PSH71UD with Lead Free Packaging 600V UltraFast 10-30 kHz Copack IGBT in a D2-Pak package; A IRGS6B60KD with Standard Packaging 600V Warp2 150kHz Copack IGBT in a TO-247AC package; A IRGP50B60PD1 with Standard Packaging 600V UltraFast Copack Trench IGBT in a TO-247AD package with Ultra-Low VF Diode for Induction Heating and Soft Switching Apps; A IRGP4068D-EPBF with Standard Packaging 600V HyperFast 1-8 kHz Co-Pack IGBT in a D2-Pak package; A IRG4BC30FD-S with Standard Packaging 600V UltraFast 10-30 kHz Copack IGBT in a TO-262 package; A IRG4BC15UD-L with Standard Packaging 600V Low-Vceon Non Punch Through Copack IGBT in a D2-Pak package; A IRGS4B60KD1 with Standard Packaging 1200V UltraFast 5-40 kHz Copack IGBT in a TO-247AD package; Similar to IRG4PH40UD2-E with Lead Free Packaging 10位D型锁存器 600V UltraFast 8-25 kHz Copack IGBT in a D-Pak package; Similar to IRG4RC10KD with Lead Free Packaging 9位D型锁存器 600V UltraFast 10-30 kHz Copack IGBT in a TO-220AB package; A IRGB6B60KD with Standard Packaging 9位D型锁存器
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| File Size |
588.74K /
15 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10137785-031222LF
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| Description |
Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Tin plating, Black Color, 3 Positions, Non GW Compatible, without Post, Tray packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68031-222HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 22 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
G8231222YBEU
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| Description |
Board mount - Header Receptacle - Box Header 2.0mm Pitch Right Angle DIP,2x6Pin,15u\\ Gold,NY4T,Tail=2.8mm,Color-Black,Tray
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-122-26LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 26 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10136647-031222LF
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| Description |
Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, Nylon 66, Tin plating, Black Color, 3 Positions, Non GW Compatible, without Posts, Tray packing.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-122-28LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 26 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10131931-222ULF
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| Description |
Minitek®, Board to Board, Receptacle, Surface Mount, Single row, 22 Positions, 2mm (0.079inch), horizontal.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
G8231222DEU
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| Description |
Board mount - Header Receptacle - Box Header 2.0mm Pitch Right Angle DIP,2x6Pin,15u\\ Gold,NY4T,Tail=1.6mm,Color-Black,Tray
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| Tech specs |
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Official Product Page
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| Part No. |
PUMA2S4000LM-020 PUMA2S4000LM-025 PUMA67S4000LM-025 PUMA67S4000LM-020 PUMA67S4000ALM-020 PUMA67S4000ALM-025 PUMA77S4000M-35 PUMA67S4000M-025 PUMA2S4000M-025 PUMA77S4000M-020 PUMA77S4000M-025 PUMA67S4000ALM-35 PUMA2S4000LM-35 PUMA67S4000LM-35 PUMA2S4000I-025 PUMA77S4000I-020 PUMA77S4000I-025 PUMA2S4000L-020 PUMA2S4000L-025 PUMA67S4000I-025 PUMA77S4000AI-35 PUMA67S4000AMB-025 PUMA67S4000MB-025 PUMA77S4000AMB-025 PUMA67S4000LMB-025 PUMA67S4000ALMB-025 PUMA77S4000MB-025 PUMA2S4000LMB-020 PUMA2S4000LI-35 PUMA67S4000ALI-35 PUMA67S4000LI-35 PUMA77S4000MB-020 PUMA2S4000LI-025 PUMA2S4000LI-020
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| Description |
128K CONFIG MEM, 20 PLCC, IND(FPGA) 10MHZ, 8 LAP, COM TEMP(FPGA) 2NS, 100 TQFP, COM TEMP(FPGA) 2NS, 84 PLCC, COM TEMP(FPGA) 70NS, 44 PLCC, IND TEMP(FLASH) 70NS, 48 TSOP, COM TEMP(FLASH) 20NS, 100 PQFP, IND TEMP(EPLD) 10MHZ, 8 PDIP, COM TEMP(FPGA) 20NS, 84 PLCC, COM TEM(EPLD) 20NS, 84 PLCC, IND TEMP, GREEN(EPLD) 70NS, 44 TSOP, IND TEMP(FLASH) 10MHZ, 8 N-SOIC, IND TEMP(FPGA) 2NS, 208 PQFP, IND TEMP(FPGA) 10 MHZ, 20 PLCC, COM TEMP(FPGA) 10MHZ, 20 PLCC, COM TEMP(FPGA) 15NS, 100 TQFP, COM TEMP(EPLD) 150NS, TSOP, IND TEMP(FLASH) 90NS, TSOP, COM TEMP(FLASH) 10MHZ, 10NS, 20 PLCC, COM TEMP(FPGA) 2NS, 160 PQFP, COM TEMP(FPGA) 128 MC CPLD, 1.8V ISP TQFP IND GREEN(EPLD) 10MHZ, 44 PLCC, IND TEMP(FPGA) x32 SRAM Module X32号的SRAM模块
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| File Size |
331.98K /
10 Page |
View
it Online |
Download Datasheet
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|
 |
Amphenol Communications Solutions |
| Part No. |
77313-122-24LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 24 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-122-20LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 20 Positions
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| Tech specs |
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Official Product Page
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