| |
|
 |
Amphenol Communications Solutions |
| Part No. |
51915-448LF
|
| Description |
PwrBlade®, Power Connectors, 3DCP 16S 3ACP Right Angle Receptacle, Solder To Board
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |

Molex Electronics Ltd.
|
| Part No. |
0713085412 71308-5412
|
| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 12 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 12 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
| File Size |
1,475.56K /
8 Page |
View
it Online |
Download Datasheet
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
68695-448HLF
|
| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Double Row, 48 Positions, 2.54mm Pitch, Right Angle, 5.84mm (0.23in) Mating, 2.29mm (0.09in) Tail.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |

Molex Electronics Ltd.
|
| Part No. |
0713085414 71308-5414
|
| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 14 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 14 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
| File Size |
1,475.56K /
8 Page |
View
it Online |
Download Datasheet
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
79425-448HLF
|
| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 48 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |

Molex Electronics Ltd.
|
| Part No. |
0713085416 71308-5416
|
| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 16 Circuits,1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 16 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
| File Size |
1,475.55K /
8 Page |
View
it Online |
Download Datasheet
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
68405-448HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 48 Positions, 2.54 mm (0.100in)Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
68685-448LF
|
| Description |
Dubox®, Board to Board connector, PCB Mounted Receptacle, Vertical, Through Hole, Top Entry, Single Row, 48 positions, 2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |

Molex Electronics Ltd.
|
| Part No. |
0713085420 71308-5420
|
| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 20 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 20 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
| File Size |
1,475.56K /
8 Page |
View
it Online |
Download Datasheet
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
10135448-002LF
|
| Description |
HPCE VT Receptacle 24P Without Peg
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
75915-448HLF
|
| Description |
Dubox® 2.54mm, Board to Board Connector,Vertical Receptacle, Through Hole, Single row , 48 Positions, 2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
|

Bom2Buy.com

Price and Availability
|