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For prove Found Datasheets File :: 403    Search Time::1.609ms    
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    IT3D-300S-BGA IT3M-300S-BGA IT3-300P-17H IT3-300P-32H TR0636E-10026

Hirose Electric
Part No. IT3D-300S-BGA IT3M-300S-BGA IT3-300P-17H IT3-300P-32H TR0636E-10026
OCR Text ...imulate actual applications and prove BGA attachment reliability. All processes described herein, including test board design and thermal cycling test conditions, are based on and conform to IPC-9701. All assembly and re-work processes w...
Description IT3 Thermal Cycling Test Report

File Size 1,713.89K  /  21 Page

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    MCR01MZPFL MCR012

Rohm
Part No. MCR01MZPFL MCR012
OCR Text ...by 4 proves. Upper termination prove Variation of resistance with temperature Overload See Table.1 (2.0%+0.005) A new uniform coating of minimum of 95% of the surface being immersed and no soldering damage. (1.0%+0.005) No remarkab...
Description Low Ohmic Thick Film Chip Resistors

File Size 62.82K  /  5 Page

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    MCR100JZHFL MCR100 MCR100JZHFS0.068OHM MCR100JZHFS0.047OHM MCR100JZHJS0.068OHM MCR100JZHJS0.047OHM MCR100JZHFS0.082OHM M

Rohm
Part No. MCR100JZHFL MCR100 MCR100JZHFS0.068OHM MCR100JZHFS0.047OHM MCR100JZHJS0.068OHM MCR100JZHJS0.047OHM MCR100JZHFS0.082OHM MCR100JZHJS0.056OHM MCR100JZHFS0.056OHM MCR100JZHJS0.082OHM MCR100JZHJL
OCR Text ...by 4 proves. Upper termination prove Variation of resistance with temperature Overload See Table.1 (2.0%+0.005) A new uniform coating of minimum of 95% of the surface being immersed and no soldering damage. (1.0%+0.005) No remarkab...
Description Low Ohmic Thick Film Chip Resistors
RESISTOR, METAL GLAZE/THICK FILM, 1 W, 1 %, 800 ppm, 0.068 ohm, SURFACE MOUNT, 2512 CHIP
RESISTOR, METAL GLAZE/THICK FILM, 1 W, 1 %, 800 ppm, 0.047 ohm, SURFACE MOUNT, 2512 CHIP
RESISTOR, METAL GLAZE/THICK FILM, 1 W, 5 %, 800 ppm, 0.068 ohm, SURFACE MOUNT, 2512 CHIP
RESISTOR, METAL GLAZE/THICK FILM, 1 W, 5 %, 800 ppm, 0.047 ohm, SURFACE MOUNT, 2512 CHIP
RESISTOR, METAL GLAZE/THICK FILM, 1 W, 1 %, 800 ppm, 0.082 ohm, SURFACE MOUNT, 2512 CHIP
RESISTOR, METAL GLAZE/THICK FILM, 1 W, 5 %, 800 ppm, 0.056 ohm, SURFACE MOUNT, 2512 CHIP
RESISTOR, METAL GLAZE/THICK FILM, 1 W, 1 %, 800 ppm, 0.056 ohm, SURFACE MOUNT, 2512 CHIP
RESISTOR, METAL GLAZE/THICK FILM, 1 W, 5 %, 800 ppm, 0.082 ohm, SURFACE MOUNT, 2512 CHIP

File Size 73.80K  /  5 Page

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    Q67041-A4696-A001

Infineon Technologies AG
Part No. Q67041-A4696-A001
OCR Text prove * positive temperature coefficient * easy paralleling C This chip is used for: * chip only Applications: * drives G E Chip Type SIGC144T170R2C VCE 1700V ICn 75A Die Size 11.98 x 11.98 mm2 Package sawn on foil...
Description IGBT Chip in NPT-technology

File Size 68.76K  /  4 Page

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    R2043T-E2 R2043K-E2

RICOH electronics devices division
Part No. R2043T-E2 R2043K-E2
OCR Text ...settings) With Power-on flag to prove that the power supply starts from 0V 32-kHz clock output pin (N-channel open drain output) Supply voltage monitoring circuit with two supply voltage monitoring threshold settings Automatic identificatio...
Description 4-wire Serial Interface

File Size 477.19K  /  48 Page

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    SIGC12T60SNC

Infineon Technologies AG
Part No. SIGC12T60SNC
OCR Text prove * positive temperature coefficient * easy paralleling C This chip is used for: * SGP10N60 Applications: * drives G E Chip Type SIGC12T60SNC SIGC12T60SNC VCE 600V 600V ICn 10A 10A Die Size 3.5 x 3.5 mm2 3.5 x 3.5 ...
Description IGBT Chip in NPT-technology 600V NPT technology positive temperature coefficient

File Size 75.05K  /  4 Page

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    SIGC42T60UN

Infineon Technologies AG
Part No. SIGC42T60UN
OCR Text prove * positive temperature coefficient easy paralleling This chip is used for: * SGW50N60HS Applications: * Welding * PFC * UPS C G E Chip Type SIGC42T60UN VCE 600V ICn 50A Die Size 6.5 x 6.5 mm2 Package sawn on fo...
Description High Speed IGBT Chip in NPT-technology positive temperature coefficient easy paralleling

File Size 59.73K  /  4 Page

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    SIGC81T60SNC

Infineon Technologies AG
Part No. SIGC81T60SNC
OCR Text prove * positive temperature coefficient * easy paralleling C This chip is used for: * IGBT-Modules Applications: * drives G E Chip Type SIGC81T60SNC VCE 600V ICn 100A Die Size 8.99 x 8.99 mm2 Package sawn on foil ...
Description IGBT Chip in NPT-technology 600V NPT technology positive temperature coefficient

File Size 75.29K  /  4 Page

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    M67025E07 M67025E-14

ATMEL Corporation
Part No. M67025E07 M67025E-14
OCR Text ...er incurs wait states. This can prove to be a considerable advantage in very high speed systems. How The Semaphore Flags Work The semaphore logic is a set of eight latches independent of the dual-port RAM. These latches can be used to...
Description Rad. Tolerant High Speed 8 Kb x 16 Dual Port RAM
Separate Upper Byte and Lower Byte Control for Multiplexed Bus Compatibility

File Size 634.70K  /  27 Page

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    TJA1028 TJA1028T3V310 TJA1028T5V010 TJA1028T5V020 TJA1028TK3V310 TJA1028TK3V320 TJA1028TK5V010 TJA1028TK5V020 TJA1028T3V

NXP Semiconductors
Part No. TJA1028 TJA1028T3V310 TJA1028T5V010 TJA1028T5V020 TJA1028TK3V310 TJA1028TK3V320 TJA1028TK5V010 TJA1028TK5V020 TJA1028T3V320
OCR Text ... by over 70 %. This feature can prove extremely valuable when board space is limited. 2. Features and benefits LIN 2.0/2.1 compliant SAE J2602 compliant Downward compatible with LIN 1.3 Internal LIN slave termination resistor Voltage re...
Description LIN transceiver with integrated voltage regulator

File Size 182.97K  /  24 Page

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