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				Central Semiconductor Corp
Part No.	CP382X
OCR Text	process cp382x small signal transistor npn - low v ce(sat) transistor chip process details die size 26 x 26 mils die thickness 5.9 mils base bonding pad area 5.5 x 5.5 mils emitter bonding pad area 5.5 x 5.5 mils top sid...
Description	Small Signal Transistor NPN - Low VCE(SAT) Transistor Chip
File Size	727.03K / 2 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	CAT5138 CAT5137 CAT5136
OCR Text	...initially and after a design or process change that affects the parameter. 3. integral non-linearity is utilized to determine actual wiper voltage versus expected voltage as determined by wiper position when used as a potentiometer. 4. di...
Description	Digital Potentiometers (POTs) with 128 Taps and I2C Interface
File Size	165.76K / 11 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	CAT5132
OCR Text	...initially and after a design or process change that affects the parameter. 6. absolute linearity is utilized to determine actual wiper voltage versus expected voltage as determined by wiper position when used as a potentiometer. 7. relativ...
Description	16 Volt Digital Potentiometer (POT) with 128 Taps and I2C Interface
File Size	175.58K / 12 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers List of Unclassifed Man...
Part No.	WPC
OCR Text	process information and data (?information?) in this document is an outline only , for general information purposes ; it doe s not constitute a representation or warranty as to capability , performance or suitability of the process fo...
Description	Bipolar process
File Size	44.83K / 1 Page	View it Online	Download Datasheet

				Tyco
Part No.	TPB11CGVRA TPB11FGRA TPBF11FGRA TPB21RGPC TPB11FGVRA
OCR Text	...tches, tiny, part number matrix process seal version not process seal version available f = flush actuator* g = gold none = silver blank=wire lug pc=printed circuitra=right angle* vra=vertical right angle**** 0=black 2=red blank= sq. n...
Description	TP Series Pushbutton Switches
File Size	473.87K / 7 Page	View it Online	Download Datasheet

				Ceramate Technical
Part No.	SMV1812MXXXKRR
OCR Text	...ing and gradual cooling process is suggested. ir soldering has the highest yields due to controlled heating rates and solder liquids times. make sure that the element is not 2 .4 the ...
Description	Zinc Oxide
File Size	269.86K / 9 Page	View it Online	Download Datasheet

				Rohm
Part No.	SMLD12HBC7W1
OCR Text	.... (see fig-2) number of reflow process shall be max 2 times and these processes shall be performed in a row. cooling process to normal te mperature shall be required between the first and the s econd soldering process. 3. handling ...
Description	Surface Mount Chip LED
File Size	171.77K / 7 Page	View it Online	Download Datasheet

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