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  flat ribbon Datasheet PDF File

For flat ribbon Found Datasheets File :: 1933    Search Time::2.578ms    
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    FAIRCHILD[Fairchild Semiconductor]
Part No. RMPA27000
OCR Text ...er should be machined, finished flat, plated with gold over nickel and should be capable of withstanding 325C for 15 minutes. Die attachment...ribbon bond equipment must be well grounded to prevent static discharges through the device. Recomme...
Description 27- 29 GHZ 1.8 Watt Power Amplifier MMIC
27-29 GHZ 1.8 Watt Power Amplifier MMIC

File Size 241.36K  /  9 Page

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    FAIRCHILD[Fairchild Semiconductor]
Fairchild Semiconductor Corporation
Part No. RMPA39000
OCR Text ...er should be machined, finished flat, plated with gold over nickel and should be capable of withstanding 325C for 15 minutes. Die attachment...ribbon bond equipment must be well grounded to prevent static discharges through the device. Recomme...
Description 37 - 40 GHz GaAs MMIC Power Amplifier
37-40 GHz GaAs MMIC Power Amplifier

File Size 198.78K  /  10 Page

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    FAIRCHILD[Fairchild Semiconductor]
Fairchild Semiconductor Corporation
Part No. RMPA39100
OCR Text ...er should be machined, finished flat, plated with gold over nickel and should be capable of withstanding 325C for 15 minutes. Die attachment...ribbon bond equipment must be well grounded to prevent static discharges through the device. Recomme...
Description 37 - 40 GHz 1 Watt Power Amplifier MMIC
37-40 GHz 1 Watt Power Amplifier MMIC
DIODE SWITCHING DUAL-DUAL SERIES 240V 225mA-Io 350mW 50ns-trr SOT-26 3K/REEL

File Size 464.86K  /  10 Page

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    RAYTHEON[Raytheon Company]
Part No. RMPA61800
OCR Text ...er should be machined, finished flat, plated with gold over nickel and should be capable of withstanding 325C for 15 minutes. Die attachment...ribbon bond equipment must be well grounded to prevent static discharges through the device. Recomme...
Description Dual Channel 6-18 GHz 2 Watt Power Amplifier MMIC

File Size 378.43K  /  7 Page

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    FAIRCHILD[Fairchild Semiconductor]
Part No. RMPA61810
OCR Text ...er should be machined, finished flat, plated with gold over nickel and should be capable of withstanding 325C for 15 minutes. Die attachment...ribbon bond equipment must be well grounded to prevent static discharges through the device. Recomme...
Description 6-18 GHz 1W Power Amp
Single Channel 6-18 GHz 1 Watt Power Amplifier MMIC

File Size 544.49K  /  6 Page

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    FAIRCHILD[Fairchild Semiconductor]
Part No. RMWB04001
OCR Text ...er should be machined, finished flat, plated with gold over nickel and should be capable of withstanding 325C for 15 minutes. Die attachment...ribbon bond equipment must be well grounded to prevent static discharges through the device. Recomme...
Description 4 GHz Buffer Amplifier MMIC

File Size 105.53K  /  7 Page

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    FAIRCHILD[Fairchild Semiconductor]
Part No. RMWB11001
OCR Text ...er should be machined, finished flat, plated with gold over nickel and should be capable of withstanding 325C for 15 minutes. Die attachment...ribbon bond equipment must be well grounded to prevent static discharges through the device. Recomme...
Description 11 GHz Buffer Amplifier MMIC

File Size 349.24K  /  6 Page

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    FAIRCHILD[Fairchild Semiconductor]
Part No. RMWB12001
OCR Text ...er should be machined, finished flat, plated with gold over nickel and should be capable of withstanding 325C for 15 minutes. Die attachment...ribbon bond equipment must be well grounded to prevent static discharges through the device. Recomme...
Description 12 GHz Buffer Amplifier MMIC

File Size 195.44K  /  6 Page

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    FAIRCHILD[Fairchild Semiconductor]
Part No. RMWB24001
OCR Text ...er should be machined, finished flat, plated with gold over nickel and should be capable of withstanding 325C for 15 minutes. Die attachment...ribbon bond equipment must be well grounded to prevent static discharges through the device. Recomme...
Description 24 GHz Buffer Amplifier MMIC

File Size 91.67K  /  7 Page

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    FAIRCHILD[Fairchild Semiconductor]
Part No. RMWB33001
OCR Text ...er should be machined, finished flat, plated with gold over nickel and should be capable of withstanding 325C for 15 minutes. Die attachment...ribbon bond equipment must be well grounded to prevent static discharges through the device. Recomme...
Description 33 GHz Buffer Amplifier MMIC

File Size 228.15K  /  6 Page

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For flat ribbon Found Datasheets File :: 1933    Search Time::2.578ms    
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