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EH8010ZI CR10C XHP2100 80025 72N15N 100200 LQ150X B43510
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For composition Found Datasheets File :: 3629    Search Time::1.453ms    
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    M35071 M35071-002FP M35071-002SP M35071-052SP M35071-054FP M35071-055FP M35071-055SP M35071-058SP M35071-066FP M35071-06

MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. M35071 M35071-002FP M35071-002SP M35071-052SP M35071-054FP M35071-055FP M35071-055SP M35071-058SP M35071-066FP M35071-067SP M35071-068SP
OCR Text ...- XXXSP FEATURES * Screen composition ................ 24 characters x 12 lines x 2 pages * Number of characters displayed .................. 288 (Max.) x 2 pages * Character composition ..................................... 12 x 18 d...
Description SCREEN CHARACTER and PATTERN DISPLAY CONTROLLERS

File Size 244.15K  /  50 Page

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    M35072 M35072-002FP M35072-059FP

MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. M35072 M35072-002FP M35072-059FP
OCR Text ...1 M35072 - XXXFP * Screen composition ................ 24 characters x 12 lines x 2 pages * Number of characters displayed .................. 288 (Max.) x 2 pages * Character composition ..................................... 12 x 18 d...
Description SCREEN CHARACTER and PATTERN DISPLAY CONTROLLERS

File Size 238.60K  /  52 Page

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    SA608D SA608DK SA608N SA608

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. SA608D SA608DK SA608N SA608
OCR Text ...+1% 5k +1% 2.4k +5% 1/4W Carbon composition 3.3k +5% 1/4W Carbon composition 16k +5% 1/4W Carbon composition *NOTE: This value can be reduced when a battery is the power source. Figure 1. SA607 45MHz Test Circuit (Relays as shown) Nov...
Description Low voltage high performance mixer FM IF system

File Size 177.41K  /  14 Page

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    SA616DK SA616

PHILIPS[Philips Semiconductors]
NXP Semiconductors
Part No. SA616DK SA616
OCR Text ...1% 10k +1% 2.4k +5% 1/4W Carbon composition 3.3k 16k SR00369 Figure 3. SA616 45MHz Test Circuit (Relays as shown) 1997 Nov 07 5 Philips Semiconductors Product specification Low-voltage high performance mixer FM IF system S...
Description From old datasheet system
Low-voltage high performance mixer FM IF system

File Size 160.53K  /  17 Page

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    HT12A HT12E 2_12E HT12E-18DIP

Holtek Semiconductor In...
HOLTEK[Holtek Semiconductor Inc]
Holtek Semiconductor Inc.
Part No. HT12A HT12E 2_12E HT12E-18DIP
OCR Text ... d d a ta c o d e p e r io d composition of information Address/data waveform Each programmable address/data pin can be externally set to one of the following two logic states as shown below. fO SC "O n e " "Z e ro " A d d re s s / ...
Description From old datasheet system
2^12 Series of Encoders
IC-REMOTE CONTROL ENCODER
2^12 Series of Eecoders(2^12系列编码器(地址线:12条;地址数据线:4,用于远程控制系

File Size 136.76K  /  13 Page

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    ICX405AK

SONY[Sony Corporation]
Part No. ICX405AK
OCR Text ...r coding of this image sensor & composition of luminance (Y) and chroma (color difference) signals As shown in the left figure, fields are read out. The charge is mixed by pairs such as A1 and A2 in the A field. (pairs such as B in the B fi...
Description Diagonal 6mm (Type 1/3) CCD Image Sensor for PAL Color Video Cameras

File Size 201.35K  /  18 Page

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    CS5210-1 CS5210-1GT3

CHERRY[Cherry Semiconductor Corporation]
Part No. CS5210-1 CS5210-1GT3
OCR Text ...R1 and R2 should be of the same composition for best tracking over temperature. The divider resistor should be placed as close to the IC as possible and connected to the output with a separate metal trace. VIN VOUT CS5210-1 Adj EXT...
Description 10A LDO 3-Pin Adjustable Linear Regulator

File Size 142.59K  /  8 Page

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    IRG4CC10KB

International Rectifier
Part No. IRG4CC10KB
OCR Text ...hanical Data Nominal Backmetal composition, Thickness: Nominal Front Metal composition, Thickness: Dimensions: Wafer Diameter: Wafer thickness: Relevant Die Mechanical Dwg. Number Minimum Street Width Reject Ink Dot Size Ink Dot Location R...
Description IRG4CC10KB IGBT Die in Wafer Form

File Size 41.17K  /  1 Page

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    IRG4CC10SB

International Rectifier
Part No. IRG4CC10SB
OCR Text ...hanical Data Nominal Backmetal composition, Thickness: Nominal Front Metal composition, Thickness: Dimensions: Wafer Diameter: Wafer thickness: Relevant Die Mechanical Dwg. Number Minimum Street Width Reject Ink Dot Size Ink Dot Location R...
Description IRG4CC10SB IGBT Die in Wafer Form

File Size 41.01K  /  1 Page

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    IRG4CC10UB

International Rectifier
Part No. IRG4CC10UB
OCR Text ...hanical Data Nominal Backmetal composition, Thickness: Nominal Front Metal composition, Thickness: Dimensions: Wafer Diameter: Wafer thickness: Relevant Die Mechanical Dwg. Number Minimum Street Width Reject Ink Dot Size Ink Dot Location R...
Description IRG4CC10UB IGBT Die in Wafer Form

File Size 40.97K  /  1 Page

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