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TOSHIBA
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| Part No. |
TY00680002/003ADGB
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| OCR Text |
...03ADGB is available in a 81-pin BGA package making it suitable for a variety of applications.
MCP Features
* * * Power supply voltage of 1.70 to 1.95 V Operating temperature of -30 to 85C Package P-TFBGA81-0710-0.80BZ (Weight: 0.15 g)
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| Description |
Pseudo SRAM and NOR Flash Memory Mixed Multi-Chip Package
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| File Size |
816.00K /
90 Page |
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Honeywell International, Inc.
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| Part No. |
CE61F30
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| OCR Text |
... ? packaging optionsCqfp, hqfp, bga ? support for major third-party eda tools description t
? 1998 fujitsu microelectronics, inc. all company and product names are trademarks or registered trademarks of their respective owners. printed in... |
| Description |
FPGA FPGA
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| File Size |
153.31K /
2 Page |
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Austin Semiconductor
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| Part No. |
AS4DDR16M72-8_ET AS4DDR16M72-8_IT AS4DDR16M72-8_XT AS4DDR16M72-6_IT AS4DDR16M72-10_ET AS4DDR16M72-10_IT AS4DDR16M72-10_XT AS4DDR16M72-75_ET AS4DDR16M72-75_IT AS4DDR16M72-75_XT AS4DDR16M72PBG AS4DDR16M72-8/XT AS4DDR16M72-75/XT AS4DDR16M72-10/ET AS4DDR16M72-6/IT AS4DDR16M72-75/IT AS4DDR16M72-8/IT AS4DDR16M72-10/IT AS4DDR16M72-10/XT AS4DDR16M72-75/ET AS4DDR16M72-8/ET
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| OCR Text |
...TIONS / FUNCTIONAL DESCRIPTION
BGA Locations SYMBOL F4, F16, G5, G15, K1, K12, CKx, CKx\ L2, L13, N6, M8 DESCRIPTION Clock: CKx and CKx\ ar...456 bits. Each chip is internally configured as a quad-bank DRAM. Each of the chip's 67,108,864-bit ... |
| Description |
16M X 72 DDR DRAM, 0.8 ns, PBGA219
16Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit
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| File Size |
352.63K /
19 Page |
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Price and Availability
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