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SGS Thomson Microelectronics
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Part No. |
DB900100W
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OCR Text |
...sm1, sm2 90 smd hybrid coupler anaren xinger 1304-3 board metclad mx3-30-c1/10c thk 0.762 mm cu 35 m substrate teflon-glass er = 2.55 back side copper flange 2 mm thickness ceramic chip capacitors atc100b or equivalent
db-900-100w 6/6 in... |
Description |
RF POWER AMPLIFIER USING 2 X PD57060S THE LDMOST FAMILY
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File Size |
125.71K /
6 Page |
View
it Online |
Download Datasheet
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SGS Thomson Microelectronics
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Part No. |
DB90080W
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OCR Text |
...sm1, sm2 90 smd hybrid coupler anaren xinger 1304-3 board metclad mx3-30-c1/10c thk 0.762 mm cu 35 m substrate teflon-glass er = 2.55 back side copper flange 2 mm thickness ceramic chip capacitors atc100b or equivalent
db-900-80w 6/6 inf... |
Description |
RF POWER AMPLIFIER USING 2 X PD57045S THE LDMOST FAMILY
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File Size |
133.44K /
6 Page |
View
it Online |
Download Datasheet
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SGS Thomson Microelectronics
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Part No. |
DB96070W
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OCR Text |
...sm1, sm2 90 smd hybrid coupler anaren xinger 1304-3 board metclad mx3-30-c1/10c thk 0.762 mm cu 35 m substrate teflon-glass er = 2.55 back side copper flange 2 mm thickness ceramic chip capacitors atc100b or equivalent
5/5 db-960-70w inf... |
Description |
RF POWER AMPLIFIER USING 2 X PD57045S THE LDMOST FAMILY
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File Size |
114.92K /
5 Page |
View
it Online |
Download Datasheet
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SGS Thomson Microelectronics
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Part No. |
DB96090W
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OCR Text |
...sm1, sm2 90 smd hybrid coupler anaren xinger 1304-3 board metclad mx3-30-c1/10c thk 0.762 mm cu 35 m substrate teflon-glass er = 2.55 back side copper flange 2 mm thickness ceramic chip capacitors atc100b or equivalent
5/5 db-960-90w inf... |
Description |
RF POWER AMPLIFIER USING 2 X PD57060S THE LDMOST FAMILY
|
File Size |
112.45K /
5 Page |
View
it Online |
Download Datasheet
|
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Price and Availability
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