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adhesive Datasheet PDF File

For adhesive Found Datasheets File :: 7245 Search Time::1.828ms
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				Fairchild Semiconductor
Part No.	TN3019A00 TN3019AJ05Z TN3019ANL
OCR Text	...ire off is emitter (on pkg. 92) adhesive tape is on the top side flat of transistor is on bottom first wire off is col lector adhesive tape is on bottom side flat of transistor is on top order style d75z (p) first wire off is col lector (on...
Description	NPN General Purpose Amplifier
File Size	448.39K / 10 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	TDA8011 TDA8011T
OCR Text	...must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. Maximum permissible solder temperature is 260 C, and max...
Description	IF amplifier for satellite TV receivers
File Size	74.46K / 12 Page	View it Online	Download Datasheet

				DB Lectro, Inc.
Part No.	BC214C
OCR Text	...re shall be no exposure of adhesive. 4. no more than 3 consecutive missing components are permitted. 5. a tape trailer, having at least three feed holes are required after the last component. 6 . s pli c e s s hall n o t interfer...
Description	FPGA Logic IC; Logic Type:Programmable; No. of Macrocells:136; Package/Case:484-FBGA 晶体管\|晶体管\|进步党\| 30V的五（巴西）总裁\| 100mA的一（c）\|2
File Size	66.39K / 4 Page	View it Online	Download Datasheet

				Fairchild Semiconductor
Part No.	TN4033A00
OCR Text	...ire off is emitter (on pkg. 92) adhesive tape is on the top side flat of transistor is on bottom first wire off is col lector adhesive tape is on bottom side flat of transistor is on top order style d75z (p) first wire off is col lector (on...
Description	PNP General Purpose Amplifier
File Size	446.39K / 9 Page	View it Online	Download Datasheet

				Marktech Corporate
Part No.	MT7103A-UR-A
OCR Text	...PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration ...
Description	3.0mm ROUND LED LAMP
File Size	127.08K / 6 Page	View it Online	Download Datasheet

				Marktech Corporate
Part No.	MT3403A-UY-A
OCR Text	...PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration ...
Description	3.0mm ROUND LED LAMP
File Size	150.40K / 6 Page	View it Online	Download Datasheet

				Marktech Corporate
Part No.	MT2003L-WR
OCR Text	...PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration ...
Description	3.0mm ROUND LED LAMP
File Size	151.91K / 6 Page	View it Online	Download Datasheet

				Fairchild Semiconductor
Part No.	TN6714A00
OCR Text	...ire off is emitter (on pkg. 92) adhesive tape is on the top side flat of transistor is on bottom first wire off is col lector adhesive tape is on bottom side flat of transistor is on top order style d75z (p) first wire off is col lector (on...
Description	NPN General Purpose Amplifier
File Size	611.42K / 12 Page	View it Online	Download Datasheet

				TRANSYS Electronics Limited
Part No.	PN4355 PN4354 PN4356
OCR Text	...TA T P h A H1 W2 L Wo W1 W adhesive Tape on Top Side (p) D FEE Carrier Strip 8.2" A h A1 LABEL FLAT SIDE 321 H0 t1 t F1 F P2 Po F2 Do 13" K 1.7 7" Flat Side of Transistor and adhesive Tape Visib...
Description	PNP SILICON PLANAR EPITAXIAL TRANSISTORS
File Size	158.64K / 3 Page	View it Online	Download Datasheet

For adhesive Found Datasheets File :: 7245 Search Time::1.828ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |