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  8ka Datasheet PDF File

For 8ka Found Datasheets File :: 131    Search Time::3.328ms    
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    5962F0721801V9A

Intersil Corporation
Part No. 5962F0721801V9A
OCR Text ...Cu (2%)/TiW Thickness: Metal 1: 8ka 0.5kA Type: Metal 2: AlCu (2%) Thickness: Metal 2: 16kA 0.8ka Substrate: UHF-1X Bonded Wafer, DI Backside Finish: Silicon ASSEMBLY RELATED INFORMATION: Substrate Potential: Floating ADDITIONAL INFORMATION...
Description Radiation Hardened Ultra High Frequency NPN-PNP Transistor Array

File Size 85.83K  /  2 Page

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    5962F9568902VEC 5962F9568902V9A HS9-26CLV32RH/PROTO HS1-26CLV32RH/PROTO

Intersil Corporation
Intersil, Corp.
Part No. 5962F9568902VEC 5962F9568902V9A HS9-26CLV32RH/PROTO HS1-26CLV32RH/PROTO
OCR Text ...horus Silicon Glass) Thickness: 8ka 1kA Substrate: AVLSI1RA, Silicon backside, VDD backside potential Metallization: Bottom: Mo/Tiw Thickness: 5800A 1kA Top: Al/Si/Cu Thickness: 10kA 1kA Worst Case Current Density: <2.0 x 105A/cm2 Bond Pad...
Description Radiation Hardened 3.3V Quad Differential Line Receiver QUAD LINE RECEIVER, CDFP16
Triple 3-input positive-AND gates 14-SOIC 0 to 70 QUAD LINE RECEIVER, CDIP16
Radiation Hardened 3.3V Quad Differential Line Receiver QUAD LINE RECEIVER, CDIP16

File Size 64.75K  /  3 Page

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    Intersil
Part No. HS-6664RH
OCR Text ...sivation: Type: SiO2 Thickness: 8ka 1kA Top Metallization: M1:6kA 1kA Si/Al/Cu 2kA 500A TiW M2:10kA 2kASi/Al/Cu ASSEMBLY RELATED INFORMATION: Substrate Potential: VDD ADDITIONAL INFORMATION: Worst Case Current Density: 2 x 105 A/cm2 Trans...
Description PROM, CMOS, 8Kx8, 65ns, 500A, Nichrome Fuse, Rad-Hard

File Size 132.60K  /  5 Page

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    ISL73096RH

Intersil Corporation
Part No. ISL73096RH
OCR Text ...Cu (2%)/TiW Thickness: Metal 1: 8ka 0.5kA Type: Metal 2: AlCu (2%) Thickness: Metal 2: 16kA 0.8ka Substrate: UHF-1X Bonded Wafer, DI Backside Finish: Silicon ASSEMBLY RELATED INFORMATION: Substrate Potential: Floating ADDITIONAL INFORMATION...
Description Radiation Hardened Ultra High Frequency NPN-PNP Transistor Array

File Size 88.67K  /  2 Page

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    Intersil
Part No. HS-6254RH
OCR Text ...Cu (2%)/TiW Thickness: Metal 1: 8ka 0.5kA Type: Metal 2: AlCu (2%) Thickness: Metal 2: 16kA 0.8ka Substrate: UHF-1X Bonded Wafer, DI Backside Finish: Silicon ASSEMBLY RELATED INFORMATION: Substrate Potential: Floating ADDITIONAL INFORMATION...
Description NPN Transistor Array, 5 NPN Array, 8GHz, 3.5dB Noise Figure, Rad-Hard

File Size 30.64K  /  3 Page

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    HS-6664RH-T

Intersil Corporation
Part No. HS-6664RH-T
OCR Text ...: Type: Silox (SiO2) Thickness: 8ka 1kA WORST CASE CURRENT DENSITY: < 2.0e5 A/cm2 TRANSISTOR COUNT: 110, 874, (27,719 Gates) PROCESS: AVLSI Si/AI/Cu 2kA 500A TiW M2: 10kA 2kA Si/AI/Cu SUBSTRATE POTENTIAL: VDD BACKSIDE FINISH: Silicon ...
Description Radiation Hardened 8K x 8 CMOS PROM(抗辐射CMOS 64K 可编程ROM)

File Size 178.11K  /  3 Page

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    HI-5883

Intersil Corporation
Part No. HI-5883
OCR Text ...SIVATION: Type: SiO2 Thickness: 8ka 1kA DIE ATTACH: Material: Gold Silicon Eutectic Alloy Temperature: Ceramic DIP - 460oC (Max) WORST CASE CURRENT DENSITY: 3.05 x 104 A/cm2 Metallization Mask Layout HI-5701/883 OVF VSS D5 ...
Description 6-Bit, 30 MSPS Flash A/D Converter(6位B>30MSPS 闪速A/D转换
6-Bit, 30 MSPS Flash A/D Converter(6位0MSPS 闪速A/D转换

File Size 65.97K  /  8 Page

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    HS9-9008RH/PROTO HS1-9008RH/PROTO HS-9008RH05

Intersil Corporation
Part No. HS9-9008RH/PROTO HS1-9008RH/PROTO HS-9008RH05
OCR Text ...sivation: Type: SiO2 Thickness: 8ka 1kA Top Metallization: Metal 1 - Type: Moly/TiW Thickness: 5.8ka 10% Metal 2- Type: Al/Si/Cu Thickness: 10kA 10% Backside Finish: Silicon ASSEMBLY RELATED INFORMATION: Substrate Potential (Powered Up): VD...
Description Radiation Hardened CMOS 8-Bit Flash Analog-to-Digital Converter

File Size 175.52K  /  4 Page

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    Intersil
Part No. ACS03MS
OCR Text ...SIVATION: Type: SiO2 Thickness: 8ka 1kA WORST CASE CURRENT DENSITY: <2.0 x 105A/cm 2 BOND PAD SIZE: 110m x 110m 4.3 mils x 4.3 mils Metallization Mask Layout ACS03MS B1 (2) A1 (1) VCC (14) B4 (13) Y1 (3) (12) A4 A2 (4) (11)...
Description NAND Gate, Quad 2-Input, Rad-Hard, Advanced Logic, CMOS

File Size 63.60K  /  3 Page

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    IFS150V12PT4

Infineon Technologies AG
Part No. IFS150V12PT4
OCR Text ... c =150a t vj =150c, di/dt,= 2,8ka/s e on 15,0 mj turn off energy loss per puls igbt, u dc =600v, i c =150a t vj =150c, du/dt = 3,5kv/s e off 13,9 mj reverse recovery energy diode, u dc =600v, i f =150a t vj =150c, di/dt = 2...
Description MIPAQserve

File Size 364.34K  /  8 Page

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For 8ka Found Datasheets File :: 131    Search Time::3.328ms    
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