|
|
 |

Molex Electronics Ltd.
|
Part No. |
14-44-5208 70475-2177 A-70475-2177
|
Description |
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 8 Circuits 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 8 Circuits
|
File Size |
149.74K /
3 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Texas Instruments |
Part No. |
V62/10606-01XE
|
Description |
Enhanced Product Quad Channel, 3/1, 1Mbps, Digital Isolator 16-SOIC -55 to 125
|
Tech specs |
|
|
Get Free Sample |
Official Product Page
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
14-44-5207 A-70475-2176
|
Description |
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 7 Circuits 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 7 Circuits
|
File Size |
149.74K /
3 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Texas Instruments |
Part No. |
V62/20606-01EX
|
Description |
Enhanced product, low-power, analog temperature sensor
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
14-44-5204 70475-2173 A-70475-2173
|
Description |
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 4 Circuits 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 4 Circuits
|
File Size |
149.74K /
3 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Texas Instruments |
Part No. |
JM38510/50606BRA
|
Description |
Low-Power High-Performance Impact PAL Circuits 20-CDIP -55 to 125
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
14-44-5206 70475-2175 A-70475-2175
|
Description |
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 6 Circuits 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 6 Circuits
|
File Size |
148.62K /
2 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Texas Instruments |
Part No. |
M38510/50606BRA
|
Description |
Low-Power High-Performance Impact PAL Circuits 20-CDIP -55 to 125
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Texas Instruments |
Part No. |
LMZ30606RKGT
|
Description |
2.95V to 6V, 6A Step-Down Power Module in 9x11x2.8mm QFN Package 39-B1QFN -40 to 85
|
Tech specs |
|
|
Get Free Sample |
Official Product Page
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
14-44-5202 A-70475-2171
|
Description |
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 2 Circuits 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 2 Circuits
|
File Size |
149.74K /
3 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Texas Instruments |
Part No. |
LMZ30606RKGR
|
Description |
2.95V to 6V, 6A Step-Down Power Module in 9x11x2.8mm QFN Package 39-B1QFN -40 to 85
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
14-44-5203 70475-2172 A-70475-2172
|
Description |
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 3 Circuits 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 3 Circuits
|
File Size |
149.74K /
3 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Texas Instruments |
Part No. |
V62/20606-01EX-T
|
Description |
Enhanced product, low-power, analog temperature sensor
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
14-44-5209 A-70475-2178
|
Description |
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 9 Circuits 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 9 Circuits
|
File Size |
148.60K /
2 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Elan Microelectronics, Corp.
|
Part No. |
TP0606
|
Description |
P-Channel Enhancement-Mode Vertical DMOS FET(击穿电压-60V,低门限2.4V,P沟道增强型垂直DMOS结构场效应管) P通道增强模式垂直的DMOS场效应管(击穿电 60V的低门限.4V,P沟道增强型垂直的DMOS结构场效应管
|
File Size |
27.28K /
4 Page |
View
it Online |
Download Datasheet
|
|

Bom2Buy.com

Price and Availability
|