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  3164 Datasheet PDF File

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    SIEMENS[Siemens Semiconductor Group]
Infineon
Part No. HYB3164405L-60 HYB3164405L-50 HYB3164405T-60 HYB3164405T-50 HYB3164405J-60 HYB3164405J-50 HYB3165405J-60 HYB3165405J-50 HYB3165405TL-60 HYB3164405J HYB3164405TL-50 HYB3164405TL-60 HYB3165405T-50 HYB3165405T-60 HYB3165405TL-50
Description 16M x 4-Bit Dynamic RAM (4k & 8k Refresh, EDO-version)

File Size 471.24K  /  32 Page

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Amphenol Communications Solutions

Part No. 61083-164402LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





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SIEMENS AG
Part No. HYB3164805BT-40 HYB3165805BT-40 HYB3165805BJ-40 HYB3164805BJ-40 HYB3165805BTL-50 HYB3164805BJ-60
Description 8M x 8-Bit Dynamic RAM 8M X 8 EDO DRAM, 50 ns, PDSO32

File Size 306.96K  /  29 Page

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Amphenol Communications Solutions

Part No. 131-6414-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    HYB3165405BT-40 HYB3164405BT-40 HYB3164405BJ-40 HYB3165405BJ-40 HYB3164405BJ-50 HYB3164405BTL-60 HYB3165405BJ-60 HYB3165

http://
Infineon Technologies AG
SIEMENS AG
Part No. HYB3165405BT-40 HYB3164405BT-40 HYB3164405BJ-40 HYB3165405BJ-40 HYB3164405BJ-50 HYB3164405BTL-60 HYB3165405BJ-60 HYB3165405BJ-50
Description 16M x 4-Bit Dynamic RAM 16M X 4 EDO DRAM, 50 ns, PDSO32
16M x 4-Bit Dynamic RAM 16M X 4 EDO DRAM, 40 ns, PDSO32
16M X 4 EDO DRAM, 40 ns, PDSO32 0.400 INCH, PLASTIC, SOJ-32
16M X 4 EDO DRAM, 40 ns, PDSO32 0.400 INCH, PLASTIC, TSOP2-32

File Size 307.00K  /  29 Page

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Amphenol Communications Solutions

Part No. 131-6418-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

   
Part No. LC66E531652DIP LC66E531648QFP
Description 4-Bit Microcontroller 4位微控制

File Size 1,134.28K  /  26 Page

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Amphenol Communications Solutions

Part No. 69133-164HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 64 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Infineon
SIEMENS[Siemens Semiconductor Group]
Part No. HYB3165405BTL-60 HYB3165405BTL-50 HYB3165405BTL-40 HYB3165405BT-60 HYB3165405BT-50 HYB3165405BT-40 HYB3165405BJ-60 HYB3165405BJ-50 HYB3165405BJ-40 HYB3164405BTL-60 HYB3164405BTL-50 HYB3164405BTL-40 HYB3164405BT-60 HYB3164405BT-50 HYB3164405BT-40 HYB3164405BJ-60 HYB3164405BJ-50 HYB3164405BJ-40 HYB3164405BJ
Description 16M x 4 Bit 4k EDO DRAM
16M x 4-Bit Dynamic RAM (4k & 8k Refresh, EDO-version)

File Size 301.28K  /  29 Page

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Amphenol Communications Solutions

Part No. 61083-164429LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    SIEMENS[Siemens Semiconductor Group]
Infineon
Part No. HYB3165805BTL-60 HYB3165805BTL-50 HYB3165805BTL-40 HYB3165805BT-60 HYB3165805BT-50 HYB3165805BT-40 HYB3165805BJ-60 HYB3165805BJ-50 HYB3165805BJ-40 HYB3164805BTL-60 HYB3164805BTL-50 HYB3164805BTL-40 HYB3164805BT-60 HYB3164805BT-50 HYB3164805BT-40 HYB3164805BJ-60 HYB3164805BJ-50 HYB3164805BJ-40 HYB3164805BJ
Description 8M x 8-Bit Dynamic RAM (4k & 8k Refresh, EDO-version)

File Size 301.25K  /  29 Page

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Amphenol Communications Solutions

Part No. 131-6418-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    HYB3165405ATL-60 HYB3165405ATL-50 HYB3165405ATL-40 HYB3165405AT-60 HYB3165405AT-50 HYB3165405AT-40 HYB3165405AJ-60 HYB31

Infineon
SIEMENS[Siemens Semiconductor Group]
Part No. HYB3165405ATL-60 HYB3165405ATL-50 HYB3165405ATL-40 HYB3165405AT-60 HYB3165405AT-50 HYB3165405AT-40 HYB3165405AJ-60 HYB3165405AJ-50 HYB3165405AJ-40 HYB3164405ATL-60 HYB3164405ATL-50 HYB3164405ATL-40 HYB3164405AT-60 HYB3164405AT-50 HYB3164405AT-40 HYB3164405AJ-60 HYB3164405AJ-50 HYB3164405AJ-40 HYB3164405AJ HB64405A
Description 16M x 4 Bit 4k EDO DRAM
16M x 4 Bit 8k EDO DRAM
16M x 4-Bit Dynamic RAM (4k & 8k Refresh, EDO-Version)
From old datasheet system

File Size 327.58K  /  29 Page

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Amphenol Communications Solutions

Part No. 77316-457LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single row , Polarized, 17 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    HYB3165805ATL-60 HYB3165805ATL-50 HYB3165805ATL-40 HYB3165805AT-60 HYB3165805AT-50 HYB3165805AT-40 HYB3165805AJ-60 HYB31

Infineon
SIEMENS[Siemens Semiconductor Group]
Part No. HYB3165805ATL-60 HYB3165805ATL-50 HYB3165805ATL-40 HYB3165805AT-60 HYB3165805AT-50 HYB3165805AT-40 HYB3165805AJ-60 HYB3165805AJ-50 HYB3165805AJ-40 HYB3164805ATL-60 HYB3164805ATL-50 HYB3164805ATL-40 HYB3164805AT-60 HYB3164805AT-50 HYB3164805AT-40 HYB3164805AJ-60 HYB3164805AJ-50 HYB3164805AJ-40 HYB3164805AJ HB64805A
Description 4M x 16 Bit 4k EDO DRAM Low Power
8M x 8 Bit 4k EDO DRAM
8M x 8 Bit 8k EDO DRAM
8M x 8-Bit Dynamic RAM (4k & 8k Refresh, EDO-Version)
From old datasheet system

File Size 327.52K  /  29 Page

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Amphenol Communications Solutions

Part No. 131-6416-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    Infineon
SIEMENS[Siemens Semiconductor Group]
Part No. HYB3165400ATL-60 HYB3165400ATL-50 HYB3165400ATL-40 HYB3165400AT-60 HYB3164400ATL-60 HYB3164400ATL-50 HYB3164400ATL-40 HYB3164400AT-60 HYB3164400AT-50 HYB3164400AT-40 HYB3164400AJ-60 HYB3164400AJ-50 HYB3164400AJ-40 HB64400A HYB3164_5400ATL HYB3164400AJ HYB3165400AJ-40 HYB3165400AJ-50 HYB3165400AJ-60 HYB3165400AT-40 HYB3165400AT-50
Description 16M x 4 Bit 8k DRAM
16M x 4-Bit Dynamic RAM (4k & 8k Refresh)
From old datasheet system

File Size 246.71K  /  26 Page

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Amphenol Communications Solutions

Part No. 77316-448LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single row , Polarized, 3 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    Infineon
SIEMENS[Siemens Semiconductor Group]
Part No. HYB3164800ATL-60 HYB3164800ATL-50 HYB3164800ATL-40 HYB3164800AT-60 HYB3164800AT-50 HYB3164800AT-40 HYB3164800AJ-60 HYB3164800AJ-50 HYB3164800AJ-40 HYB3165800ATL-60 HYB3165800ATL-50 HYB3165800ATL-40 HYB3165800AT-60 HYB3165800AT-50 HYB3165800AT-40 HYB3165800AJ-60 HYB3165800AJ-50 HYB3165800AJ-40 HB64800A HYB3164_5800ATL HYB3164800AJ
Description 8M x 8 Bit 4k DRAM
8M x 8-Bit Dynamic RAM ( 4k & 8k Refresh)
From old datasheet system

File Size 247.22K  /  26 Page

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Amphenol Communications Solutions

Part No. 131-6414-21H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Right End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

For 3164 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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