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  SW65-0114 Datasheet PDF File

For SW65-0114 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    DD21 DD21.0124.1111 DD21.0114.1111 DD21.0111.1111 DD21.0113.1111 DD21.0123.1111 DD21.0121.1111

Schurter Inc.
Part No. DD21 DD21.0124.1111 DD21.0114.1111 DD21.0111.1111 DD21.0113.1111 DD21.0123.1111 DD21.0121.1111
Description IEC Appliance Inlet C14 with Line Switch 2-pole, Fuseholder 1- or 2-pole, for PCB mounting

File Size 494.29K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    39-00-0114 5556PBS

Molex Electronics Ltd.
http://
Part No. 39-00-0114 5556PBS
Description 4.20mm (.165) Pitch Mini-Fit Crimp Terminal, Female, Tin Plating, 18- 24 AWG, Reel

File Size 219.96K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

    1140-4002 0011-40-4002 001140-4002 83002

Molex Electronics Ltd.
Part No. 1140-4002 0011-40-4002 001140-4002 83002
Description Conductor Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114828-10114LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    1140-4321 11-40-4321 001140-4321 0011-40-4321 83361

Molex Electronics Ltd.
Part No. 1140-4321 11-40-4321 001140-4321 0011-40-4321 83361
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114830-10114LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    83412 1140-4376 11-40-4376 0011-40-4376 001140-4376

Molex Electronics Ltd.
Part No. 83412 1140-4376 11-40-4376 0011-40-4376 001140-4376
Description Insulation Punch

File Size 14.57K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114868-T0J-20DLF
Description XCede® High Speed Backplane Connectors, Right polarized guide header module with key.
Tech specs    

Official Product Page

    0011-40-4571 1140-4571 001140-4571 83509

Molex Electronics Ltd.
Part No. 0011-40-4571 1140-4571 001140-4571 83509
Description Insulation Anvil

File Size 16.08K  /  1 Page

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Amphenol Communications Solutions

Part No. 77315-401-14LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 14 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0011-40-4570 1140-4570 001140-4570 83508

Molex Electronics Ltd.
Part No. 0011-40-4570 1140-4570 001140-4570 83508
Description Insulation Punch

File Size 14.80K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114868-00J-20DLF
Description XCede® High Speed Backplane Connectors, 2 wall header.
Tech specs    

Official Product Page

    83411 0011-40-4375 001140-4375

Molex Electronics Ltd.
Part No. 83411 0011-40-4375 001140-4375
Description Conductor Punch

File Size 11.48K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114868-10J-20DLF
Description XCede® High Speed Backplane Connectors, 4 wall header.
Tech specs    

Official Product Page

    20100-2 20101-1 20100-1 20102-2 20113 20114

RHOPOINT COMPONENTS
Part No. 20100-2 20101-1 20100-1 20102-2 20113 20114
Description Butt bonded thermocouples

File Size 98.96K  /  1 Page

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Amphenol Communications Solutions

Part No. 10072354-F01-14ULF
Description Minitek®, Wire to Board Connectors, Shrouded Header - Through Mount Pin-in-Paste - Double row - 14 Positions - 2mm (0.079inch) - Right Angle
Tech specs    

Official Product Page

    XF0114-VPCMC3

XFMRS Inc.
Part No. XF0114-VPCMC3
Description Common Mode Choke

File Size 32.55K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114826-00011LF
Description 1.25mm Wire to Board Housing, 11 Positions
Tech specs    

Official Product Page

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Part: SW65-0440
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