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  processes. Datasheet PDF File

For processes. Found Datasheets File :: 15566    Search Time::1.422ms    
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    PEB1756E PEB1756E09 PEB1756AE

Exar Corporation
Part No. PEB1756E PEB1756E09 PEB1756AE
OCR Text ...tem/backplane * TFI-5 Support * Processes SONET/SDH dual STS-192/STM-64 on the line side interface * Provides interfaces for dropping alarm and status information, and for forcing alarm conditions * Supports system-side input deskew...
Description PEB1756E TETHYS垄芒 4192 DUAL STS-192/STM-64 MUX/DEMUX
PEB1756E TETHYS 4192 DUAL STS-192/STM-64 MUX/DEMUX

File Size 34.28K  /  2 Page

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    MILL-MAX MFG CORP
Part No. 8301-2-24-21-00-00-01-0
OCR Text ...pfoa? and?pfos?in?metal?plating?processes. reference: 1. directive 2002/95/ec of the european parliament and of the council of january 27 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equip...
Description BRASS, GOLD (20) OVER NICKEL FINISH, PCB TERMINAL

File Size 95.35K  /  2 Page

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    Q-A-500 S2432-M S2432-O S-A-10AS S-A-25 S-A-100 S-A-5AS S3020-P S3020-S S1716-P OS-A-100 OS-A-5 OS-B-10AS SW6BPF-10 S323

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Part No. Q-A-500 S2432-M S2432-O S-A-10AS S-A-25 S-A-100 S-A-5AS S3020-P S3020-S S1716-P OS-A-100 OS-A-5 OS-B-10AS SW6BPF-10 S3234-O S3417-O S3444-O EBSC15 EBSC100 S1227-O S3017-O SW5PF-10 SW5PFA-10 SW5PFAS-10 SW5PFR-10 S2745-S S2626-M S2626-O S2626-P S2626-S SW6WFCAS-10 S3444-S EBIPA100 S3219-O S-D-25 S-D-10 S-D-5 S-D-100 EBIPA15 S-E-10AS S-C-10AS S-C-5AS S-C-25 S8517-P EB41E1616 OS-E-10 OS-C-10AS OS-D-25 OS-E-100 OS-B-5AS OS-C-5AS OS-D-100 EB41P2821 Q-A-100 Q-A-5AS EB41P1616 EB41P1616-108
OCR Text ...mentally friendly chemicals and processes  packaged in 5, 10, 25, 100 and 500 foot lengths onestep clean, fast, reliable  oxide-free clean copper  more strands of copper (more surface area) per square inch  flux residue remaining on bo...
Description QUICK BRAID Cleaner, Faster, More Consistent
DESOLDERING BRAID
   QUICK BRAID Cleaner, Faster, More Consistent
   DESOLDERING BRAID

File Size 384.93K  /  9 Page

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    T494A226004A T494C476004A T494A335004A T494C686004A T494B106004A T494B336004A T494A107004A T494V157004A T494C226004A T49

Kemet Corporation
Part No. T494A226004A T494C476004A T494A335004A T494C686004A T494B106004A T494B336004A T494A107004A T494V157004A T494C226004A T494C107004A
OCR Text ...highly automated surface mount processes and equipment. the t494 combines kemets proven solid tantalum technology, acclaimed and respected throughout the world, with the latest in materials, processes and automation, resulting in unsu...
Description Low ESR MnO2 Tantalum & Aluminum Surface Mount Capacitors T494 Industrial Grade Low ESR MnO2 Series

File Size 1,320.04K  /  23 Page

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    PEB1757E PEB1757E08 PEB1757AE

Exar Corporation
Part No. PEB1757E PEB1757E08 PEB1757AE
OCR Text ...ne and system side interfaces * Processes SONET/SDH flexible concatenation streams of STS-2c, 3c, 4c, ... to 192c * Supports auto-detection of concatenation streams STS3c/STM-1, STS-12c/STM-4 and STS-48c/STM-16 * Supports STS-1 level...
Description TETHYS垄芒 2 STS-192/STM-64, 16 STS-48/STM-16, MUX/DEMUX
TETHYS 2 STS-192/STM-64, 16 STS-48/STM-16, MUX/DEMUX

File Size 27.15K  /  2 Page

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    IT3D-300S-BGA IT3M-300S-BGA IT3-300P-17H IT3-300P-32H TR0636E-10026

Hirose Electric
Part No. IT3D-300S-BGA IT3M-300S-BGA IT3-300P-17H IT3-300P-32H TR0636E-10026
OCR Text ...BGA attachment reliability. All processes described herein, including test board design and thermal cycling test conditions, are based on and conform to IPC-9701. All assembly and re-work processes were performed by Jabil Circuit, Inc. (...
Description IT3 Thermal Cycling Test Report

File Size 1,713.89K  /  21 Page

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    UPG2045TQ UPG2045TQ-E1

NEC
Part No. UPG2045TQ UPG2045TQ-E1
OCR Text ...o 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) VPS Peak temperature (package surface temperature) Time at temperature of 200C or higher Preheating time at 120 to 150C Maximum number of reflow proce...
Description L-BAND SP3T SWITCH

File Size 89.60K  /  8 Page

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    UPG2012TK1 UPG2012TK UPG2012TK-E2

NEC
Part No. UPG2012TK1 UPG2012TK UPG2012TK-E2
OCR Text ...o 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) VPS Peak temperature (package surface temperature) Time at temperature of 200C or higher Preheating time at 120 to 150C Maximum number of reflow proce...
Description L-BAND SPDT SWITCH

File Size 99.00K  /  9 Page

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    500R07S0R2AV4T

Johanson Technology Inc.
Part No. 500R07S0R2AV4T
OCR Text ...hniques and controlled assembly processes are utilized. due to the ceramic capacitor?s crystalline micro-structure these components are susceptible when exposed to excessive thermal or mechanical shock during circuit processing. it sh...
Description APPLICATION NOTES FOR CERAMIC CHIP CAPACITORS

File Size 69.24K  /  3 Page

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    MICROSEMI CORP-SCOTTSDALE
Part No. SMAJ4750C SMAJ4736A-TR
OCR Text ...patible with pb-free soldering processes. the rohs compliant components may include pb in the internal high melting type solder connections or glass materials of th e component as defined in the exemptions of the rohs european directive....
Description 27 V, 2 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, DO-214AC
6.8 V, 2 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, DO-214AC

File Size 279.76K  /  5 Page

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