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perimeter Datasheet PDF File

For perimeter Found Datasheets File :: 991 Search Time::0.969ms
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				美国讯泰微波有限公司上海代表 Hittite Microwave Corporation
Part No.	HMC232
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. 7 SWITCHES - CHIP 7-7 Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire....
Description	GaAs MMIC SPDT NON-REFLECTIVE SWITCH/ DC - 15.0 GHz GaAs MMIC SPDT NON-REFLECTIVE SWITCH, DC - 15.0 GHz
File Size	156.15K / 6 Page	View it Online	Download Datasheet

				ZCOMM
Part No.	CRO2236A
OCR Text	...IUS OF ALL 16 HALF HOLES AT THE perimeter OF THE BOARD ARE PLATED TO PROVIDE A SURFACE FOR THE ATTACHMENT OF THE VCO TO A PCB, IN 13 LOCATIONS, WITH 3 PADS BEING USED FOR ELECTROMECHANICAL INTERFACE. 16 SOLDER LOCATIONS REQUIRED. 2. THE SUR...
Description	VOLTAGE CONTROLLED OSCILLATOR
File Size	93.44K / 2 Page	View it Online	Download Datasheet

				ZCOMM[Z-Communications, Inc]
Part No.	CRO2260A
OCR Text	...IUS OF ALL 16 HALF HOLES AT THE perimeter OF THE BOARD ARE PLATED TO PROVIDE A SURFACE FOR THE ATTACHMENT OF THE VCO TO A PCB, IN 13 LOCATIONS, WITH 3 PADS BEING USED FOR ELECTROMECHANICAL INTERFACE. 16 SOLDER LOCATIONS REQUIRED. 2. THE SUR...
Description	VOLTAGE CONTROLLED OSCILLATOR
File Size	46.29K / 2 Page	View it Online	Download Datasheet

				Agilent (Hewlett-Packard) Agilent(Hewlett-Packard)
Part No.	ACMD-7401 ACMD-7401-TR1 ACMD-7401-BLK
OCR Text	...r) should be provided under the perimeter of the duplexer, as shown in Figure 15. The rectangular opening in the center of the duplexer ground plane (Figure 15) is strongly suggested. The 5 mm x 5 mm miniature FBAR duplexer has two via hole...
Description	MINIATURE PCS BAND DUPLEXER
File Size	302.35K / 11 Page	View it Online	Download Datasheet

				APEX[Apex Microtechnology]
Part No.	PA03 P03A
OCR Text	...e socket only by pushing on the perimeter of the package lid. Pushing the unit into the socket by applying pressure to the mounting tabs will bend the base due to the high insertion force required. The base will then not contact the heatsin...
Description	POWER OPERATIONAL AMPLIFIERS
File Size	227.30K / 5 Page	View it Online	Download Datasheet

				Z-Communications, Inc
Part No.	PSA2130C
OCR Text	...ius of all 24 half holes at the perimeter of the board are plated to provide a surface for the attachment of the PLL Module to the PCB. 16 pads are for grounding, 8 pads are for signal interface. The surface of the shield is tin-plated and ...
Description	LOW COST - HIGH PERFORMANCE PHASE LOCKED LOOP
File Size	72.54K / 2 Page	View it Online	Download Datasheet

				Xilinx
Part No.	XC2S400E6FXXX
OCR Text	... Blocks (CLBs), surrounded by a perimeter of programmable Input/Output Blocks (IOBs). There are four Delay-Locked Loops (DLLs), one at each corner of the die. Two columns of block RAM lie on opposite sides of the die, between the CLBs and t...
Description	Spartan-IIE 1.8V FPGA Family
File Size	780.94K / 103 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC140
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Mixers Wire Bonding Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding with a n...
Description	GAAS MMIC DOUBLE-BALANCED MIXER 1.0 - 2.0 GHZ
File Size	73.35K / 4 Page	View it Online	Download Datasheet

				Z-Communications, Inc
Part No.	CLV0945A
OCR Text	...IUS OF ALL 14 HALF HOLES AT THE perimeter OF THE BOARD ARE PLATED TO PROVIDE A SURFACE FOR THE ATTACHMENT OF THE VCO TO A PCB IN 11 LOCATIONS, WITH 3 PADS BEING USED FOR ELECTROMECHANICAL INTERFACE. 14 SOLDER LOCATIONS REQUIRED. 2. THE SURF...
Description	LOW COST - HIGH PERFORMANCE VOLTAGE CONTROLLED OSCILLATOR
File Size	46.40K / 2 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC383
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wit...
Description	GAAS PHEMT MMIC MEDIUM POWER AMPLIFIER, 12 - 30 GHZ
File Size	329.93K / 8 Page	View it Online	Download Datasheet

For perimeter Found Datasheets File :: 991 Search Time::0.969ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |