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AGILENT TECHNOLOGIES INC
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Part No. |
ACPM-7831-TR1 ACPM-7831-BLK
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OCR Text |
... pin 2 pin 3 gnd bottom view of packa g e vdd1 vdd1 rf in rf in vcntl vcntl rf out rf out vdd2 vdd2
2 absolute maximum ratings [1] parameter unit value vdd supply voltage v 5.0 power dissipation [2] w 2.5 bias current a 1.5 control volt... |
Description |
Amplifier. Other TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, DMA6
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File Size |
502.97K /
24 Page |
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Aimtron Technology Corp.
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Part No. |
AT1309 AT1309X-GRE
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OCR Text |
... v o l t a ge ?t iny sot - 25 packa g e a p p l i c a t i o n ? stn/ ole d bias ? perso n a l dig i tal assistan ts(pdas) ? d s c |
Description |
Micro-Power Step up DC-DC Converter Micro-Power Step up DC-DC Converter 微功耗升压DC - DC转换
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File Size |
287.64K /
14 Page |
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it Online |
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Radiotronix
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Part No. |
RCT-433-AS RCT-315-ASB
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OCR Text |
...c turi n g -frie ndly smt style packa ge and lo w- co st make the rct -4 33-a s suitable for high volume appli c ations. the rct-433-asb is suitable for ir reflo w ovens a nd ho t air solde r in g . frequenc y part numb er 433.92... |
Description |
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File Size |
321.17K /
8 Page |
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SGS Thomson Microelectronics
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Part No. |
AN264
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OCR Text |
...stematic characterisation of sm packa- ges was performed, in order to study the main factorsaffecting thermal dissipationat both levels of package design and board design. in the course of this work, the need for some critical revision of t... |
Description |
RESISTANCE TO SOLDERING HEAT AND THERMAL CHARACTERISTICS OF SMDS
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File Size |
154.13K /
11 Page |
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it Online |
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Price and Availability
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