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TY Semiconductor Co., Ltd
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| Part No. |
HSM88WA
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| Description |
MPAK package is suitable for high density surface mounting and high speed assembly
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| File Size |
56.08K /
1 Page |
 View
it Online |
Download Datasheet
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QuickLogic, Corp.
QuickLogic Corp.
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| Part No. |
QL3040-4PB456C QL3040-3PQ208I QL3040-2PB456I QL3040-1PQ208C QL3040-1PQ208I
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| Description |
40,000 usable PLD gate pASIC 3 FPGA combining high performance and high density.
40000 usable PLD gate pASIC 3 FPGA combining High performance and high density FPGA, 1008 CLBS, 40000 GATES, 225 MHz, PBGA456
40000 usable PLD gate pASIC 3 FPGA combining High performance and high density FPGA, 1008 CLBS, 40000 GATES, 225 MHz, PQFP208
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| File Size |
212.63K /
19 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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