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SGS Thomson Microelectronics
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| Part No. |
AN483
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| OCR Text |
... must break; the bonds must not detach. these pull tests are also repeated on statistical samples after accelerated life testing where parts are subjected to humidity, thermal cycling, and other stresses. mixed bonding technology can be use... |
| Description |
MIXED WIRE BONDING TECHNOLOGY FOR AUTOMOTIVE SMART POWER ICs
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| File Size |
307.34K /
4 Page |
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it Online |
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SONY
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| Part No. |
CXN1010
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| OCR Text |
...lk uart_cts spi_mosi pio_5/ usb_detach spi_csb v dd 1.8 bi-directional with programmable weak internal pull-up/down bi-directional bi-directional bi-directional bi-directional gnd bi-directional bi-directional with programmable weak interna... |
| Description |
BluetoothTM Module
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| File Size |
127.55K /
21 Page |
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it Online |
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Keenwood
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| Part No. |
KDC-2026 KDC-3026
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| OCR Text |
...te is unlocked, allowing you to detach it.
* The faceplate is a precision piece of equipment and can be damaged by shocks or jolts. For that reason, keep the faceplate in its special storage case while detached. * Do not expose the facepla... |
| Description |
(KDC-xxx) CD Receiver
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| File Size |
376.63K /
20 Page |
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it Online |
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Mitsubishi Electric Corporation
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| Part No. |
M30245FA-XXXGP
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| OCR Text |
... 16 reserved 001f 16 usb attach/detach register 00 16 0020 16 dma0 source pointer sar0 0021 16 0022 16 0023 16 0024 16 dma0 destination pointer dar0 0025 16 0026 16 0027 16 0028 16 dma0 transfer counter tcr0 0029 16 002a 16 002b 16 002c 16 ... |
| Description |
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
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| File Size |
89.31K /
13 Page |
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it Online |
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Citizen Electronics
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| Part No. |
LMC01B
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| OCR Text |
...in high voltage. do not detach the transparent cover which is equipped covering led top face of the module, nor use the product without the cover, as such usage is very risky. ? although this product is equipped with fuses ... |
| Description |
LED Modules
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| File Size |
294.08K /
7 Page |
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it Online |
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