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  90136-2309 Datasheet PDF File

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    UT2309G-AE3-R UT2309L-AE3-R

Unisonic Technologies
Part No. UT2309G-AE3-R UT2309L-AE3-R
Description P-CHANNEL ENHANCEMENT MODE

File Size 218.21K  /  4 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TLP2309
Description Photocoupler (photo-IC output), 1 Mbps, 3750 Vrms, 5pin SO6
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SI2309DS-E3

VISHAY SILICONIX
Part No. SI2309DS-E3
Description 1250 mA, 60 V, P-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-236AB

File Size 67.47K  /  5 Page

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    UT2309A-AE3-R UT2309AL-AE3-R

Unisonic Technologies
Part No. UT2309A-AE3-R UT2309AL-AE3-R
Description P-CHANNEL ENHANCEMENT MODE

File Size 167.27K  /  4 Page

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Silicon Laboratories, Inc.
Part No. SL2309ZI-1HT
Description 2309 SERIES, PLL BASED CLOCK DRIVER, 4 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO16 4.40 MM, ROHS COMPLIANT, TSSOP-16

File Size 133.19K  /  12 Page

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    Cypress Semiconductor Corp.
Part No. CY2305C-1H CY2309C-1
Description Zero Delay Buffers

File Size 122.60K  /  3 Page

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Amphenol Communications Solutions

Part No. 65823-093
Description Quickie Header, Wire to Board Connector, Double Row, 50 Positions, 2.54 mm (0.1 in.), Right Angle Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    Pericom Technology
Part No. PI6C2309-1HW PI6C2309-1HWI
Description 3.3V zero-delay buffer

File Size 157.57K  /  6 Page

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Amphenol Communications Solutions

Part No. 72309-8023RLF
Description USB 2.0, Input Output Connector, Double Deck Receptacle, Type A, Through Hole, Right Angle, 8 Positions
Tech specs    

Official Product Page

    EM22309 EM22312

Clare, Inc.
Elan Microelectronics, Corp.
Part No. EM22309 EM22312
Description 9 Seconds ASPCM Voice Synthesizer(单工作电.4V-5.0V秒语音容量的单片ASPCM语音合成 9秒ASPCM语音合成器(单工作电压为2.4V - 5.0V秒语音容量的单片ASPCM语音合成器)
12 Seconds ASPCM Voice Synthesizer(单工作电.4V-5.0V2秒语音容量的单片ASPCM语音合成 12秒ASPCM语音合成器(单工作电压为2.4V - 5.0V2秒语音容量的单片ASPCM语音合成器)

File Size 84.07K  /  16 Page

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Amphenol Communications Solutions

Part No. 72309-7033RPLF
Description USB 2.0, Input Output Connector, Double Deck Receptacle, Type A, Through Hole, Right Angle, 8 Positions
Tech specs    

Official Product Page

    CY2309 CY2305 CY2305SC-1

CYPRESS[Cypress Semiconductor]
Part No. CY2309 CY2305 CY2305SC-1
Description CY2305 and CY2309 as PCI and SDRAM Buffers

File Size 114.87K  /  10 Page

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Amphenol Communications Solutions

Part No. 68402-309LF
Description Dubox, Board to board connector, PCB Mounted Receptacle, Surface Mount, Dual Entry, Single Row, 9 Position, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-2307 0901362307

Molex Electronics Ltd.
Part No. 90136-2307 0901362307
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 7 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 7 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.33K  /  5 Page

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Amphenol Communications Solutions

Part No. 72309-5044RLF
Description UNIV SERIAL BUS DOUBLE D
Tech specs    

Official Product Page

    90136-1207 0901361207

Molex Electronics Ltd.
http://
Part No. 90136-1207 0901361207
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 7 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 7 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 72309-7013BLF
Description USB 2.0, Input Output Connector, Double Deck Receptacle, Type A, Through Hole, Right Angle, 8 Positions
Tech specs    

Official Product Page

For 90136-2309 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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