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Molex Electronics Ltd.
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Part No. |
87759-4665
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Description |
2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs 2.00mm (.079) Pitch Milli-Grid垄芒 Header, Surface Mount, Vertical, 46 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
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File Size |
280.47K /
6 Page |
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it Online |
Download Datasheet
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Texas Instruments |
Part No. |
5962-8775901M2A
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Description |
Octal Buffers/Drivers With 3-State Outputs 20-LCCC -55 to 125
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
87759-4664
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Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap 2.00mm (.079) Pitch Milli-Grid垄芒 Header, Surface Mount, Vertical, 46 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-
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File Size |
421.17K /
8 Page |
View
it Online |
Download Datasheet
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Texas Instruments |
Part No. |
5962-8775901MSA
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Description |
Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125
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Tech specs |
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Official Product Page
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Texas Instruments |
Part No. |
5962-8775901MRA
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Description |
Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
76341-425LF
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Description |
Dubox® 2.54mm, Board to Board Connector, PCB mounted Receptacle, Vertical, Through Hole, Top Entry, Single row , 25 Positions, 2.54mm (0.100in) Pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
76341-417LF
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Description |
Dubox® 2.54mm, Board to Board Connector, PCB mounted Receptacle, Vertical, Through Hole, Top Entry, Single row , 17 Positions, 2.54mm (0.100in) Pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
69173-414HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 14 Positions, 2.54 mm Pitch, Vertical, 7.49 mm (0.295 in.) Mating, 3.42 mm (0.135 in.) Tail
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
76341-414LF
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Description |
Dubox® 2.54mm, Board to Board Connector, PCB mounted Receptacle, Vertical, Through Hole, Top Entry, Single row , 14 Positions, 2.54mm (0.100in) Pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
131-3414-21H
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Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Right End Wall, Backplane Module, 2.25mm Wipe, APP.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
76341-415LF
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Description |
Dubox® 2.54mm, Board to Board Connector, PCB mounted Receptacle, Vertical, Through Hole, Top Entry, Single row , 15 Positions, 2.54mm (0.100in) Pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
92634-142HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 42 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
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Tech specs |
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Official Product Page
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Price and Availability
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