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    IMBA-910 TF-IMBA-910-A10-G2 TF-IMBA-910-A10-VE

AAEON Technology
Part No. IMBA-910 TF-IMBA-910-A10-G2 TF-IMBA-910-A10-VE
OCR Text ... ddr2 533/667/800 memory (up to 8 gb) 10/100base-tx & gigabit ethernet x 2 (optional) integrated intel? enhanced graphics core, vga supp...x16] x 1, pci-express [x4] x 1, pci x 3 industrial motherboard with intel? core? 2 duo processor ...
Description Intel? Core 2 Duo Processor, FSB 533/800/1066 MHz

File Size 428.95K  /  2 Page

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    IMBA-880 TF-IMBA-880-B10-VE

AAEON Technology
Part No. IMBA-880 TF-IMBA-880-B10-VE
OCR Text ...ctflash? type 2 x 1 usb2.0 x 8, com x 2, parallel x 1, irda x 1 pci, pci-express [x16] expansions system form factor atx processor intel? core? 2 duo/ pentium? 4/ celeron? d; lga775 cpu, fsb: 533/800/1066 mhz system memory 240-pin ...
Description Intel? Core 2 Duo/ Pentium? 4/ Celeron? D LGA775 Processor (533/800/1066 MHz FSB)

File Size 396.95K  /  2 Page

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    AS4LC4M16S0 AS4LC4M16S0-10FTC AS4LC4M16S0-10TC AS4LC4M16S0-75TC AS4LC4M16S0-8TC AS4LC8M8S0 AS4LC8M8S0-10FTC AS4LC8M8S0-1

ALSC[Alliance Semiconductor Corporation]
ETC
Part No. AS4LC4M16S0 AS4LC4M16S0-10FTC AS4LC4M16S0-10TC AS4LC4M16S0-75TC AS4LC4M16S0-8TC AS4LC8M8S0 AS4LC8M8S0-10FTC AS4LC8M8S0-10TC AS4LC8M8S0-75TC AS4LC8M8S0-8TC
OCR Text ...rganization - 2,097,152 words x 8 bits x 4 banks (8Mx8) - 1,048,576 words x 16 bits x 4 banks (4Mx16) * Fully synchronous - All signals refe...x16), DQM (x8). Row and column addresses are multiplexed. Row address: A0~A11. Column address (8Mx8)...
Description 3.3V 4Mx16 and 8Mx8 CMOS synchronous DRAM

File Size 387.58K  /  24 Page

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    HYNIX SEMICONDUCTOR INC
Part No. HY5DU56422DF-H HY5DU56422DF-K
OCR Text ...rsion release - merged hy5du564(8,16)22d(l)f and hy5du564(8,16)22d(l)f-d into hy5du564(8,16)22d(l)f. oct. 2004 1.1 1. changed all notes in...x16 device has two bytewide data strobes (udqs, ldqs) per each x8 i/o ? data outputs on dqs edges w...
Description 64M X 4 DDR DRAM, 0.75 ns, PBGA60

File Size 268.38K  /  31 Page

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    K4S280832E-TC75 K4S280832E-TL75 K4S281632E-TC60 K4S281632E-TC75 K4S281632E-TL60 K4S281632E-TL75 K4S281632F-TC60 K4S28163

Samsung Electronic
Samsung semiconductor
Part No. K4S280832E-TC75 K4S280832E-TL75 K4S281632E-TC60 K4S281632E-TC75 K4S281632E-TL60 K4S281632E-TL75 K4S281632F-TC60 K4S281632F-TC75 K4S281632F-TL60 K4S281632F-TL75 K4S280432E-TC75 K4S280432E-TL75
OCR Text ...& 3) -. Burst length (1, 2, 4 & 8 ) -. Burst type (Sequential & Interleave) * All inputs are sampled at the positive going edge of the syste...x16) for maskin * Auto & self refresh * 64ms refresh period (4K Cycle) GENERAL DESCRIPTION The K...
Description 128Mb F-die SDRAM Specification
128Mb E-die SDRAM Specification

File Size 142.11K  /  14 Page

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    K4S280832F-TC75 K4S280832F-TL75 K4S281632F-TC60 K4S281632F-TC75 K4S281632F-TL60 K4S281632F-TL75 TL431CDT K4S280432F-TCL7

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S280832F-TC75 K4S280832F-TL75 K4S281632F-TC60 K4S281632F-TC75 K4S281632F-TL60 K4S281632F-TL75 TL431CDT K4S280432F-TCL75 K4S280832F-TCL75 K4S280432F-TC75 K4S281632F-TCL60 K4S281632F-TCL75 K4S280432F-TL75
OCR Text ... & 3) -. Burst length (1, 2, 4, 8 & Full page) -. Burst type (Sequential & Interleave) * All inputs are sampled at the positive going edge o...x16) for masking * Auto & self refresh * 64ms refresh period (4K Cycle) GENERAL DESCRIPTION The ...
Description 128Mb F-die SDRAM Specification 128Mb的的F - SDRAM内存芯片规格

File Size 143.50K  /  14 Page

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    K4S510832B-TC75 K4S510832B-TCL75 K4S510432B-TC K4S510432B-TC75 K4S510432B-TCL75 K4S511632B-TC75 K4S511632B-TCL75

Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4S510832B-TC75 K4S510832B-TCL75 K4S510432B-TC K4S510432B-TC75 K4S510432B-TCL75 K4S511632B-TC75 K4S511632B-TCL75
OCR Text ... & 3) -. Burst length (1, 2, 4, 8) -. Burst type (Sequential & Interleave) * All inputs are sampled at the positive going edge of the system...x16) for masking * Auto & self refresh * 64ms refresh period (8K Cycle) GENERAL DESCRIPTION The ...
Description 512Mb B-die SDRAM Specification

File Size 147.30K  /  15 Page

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    K4S560832E-NCL75 K4S561632E-NCL60 K4S561632E-NCL75 K4S560432E-NC K4S560432E-NCL75 K4S561632E-NC75

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4S560832E-NCL75 K4S561632E-NCL60 K4S561632E-NCL75 K4S560432E-NC K4S560432E-NCL75 K4S561632E-NC75
OCR Text ... & 3) -. Burst length (1, 2, 4, 8 & Full page) -. Burst type (Sequential & Interleave) * All inputs are sampled at the positive going edge o...x16) for masking * Auto & self refresh * 64ms refresh period (8K Cycle) GENERAL DESCRIPTION The ...
Description 16M x 16 SDRAM, LVTTL, 133MHz
256Mb E-die SDRAM Specification 54pin sTSOP-II

File Size 205.22K  /  14 Page

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    K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60 K4S561632E-TL75 K4S560432E-TL

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60 K4S561632E-TL75 K4S560432E-TL75 K4S560432E-TC75 K4S560432E-TC
OCR Text ... & 3) -. Burst length (1, 2, 4, 8 & Full page) -. Burst type (Sequential & Interleave) * All inputs are sampled at the positive going edge o...x16) for masking * Auto & self refresh * 64ms refresh period (8K Cycle) GENERAL DESCRIPTION The ...
Description 256Mb E-die SDRAM Specification 54pin sTSOP-II

File Size 196.59K  /  14 Page

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